XC7A50T-1CSG324C

The XC7A50T-1CSG324C is an AMD Artix‑7 field programmable gate array (FPGA) offered in a 324‑ball LFBGA package. It provides a balance of programmable logic capacity, on‑chip memory, and a high I/O count for designs that require reconfigurable digital logic in a compact surface‑mount form factor.

With 52,160 logic elements, approximately 2.76 Mbits of embedded memory and 210 I/O pins, this commercial‑grade device targets applications that need moderate logic density, significant embedded RAM, and broad connectivity while operating within a 0 °C to 85 °C temperature range.

Key Features

• Programmable Logic Capacity  52,160 logic elements support complex digital functions and custom logic implementations.
• Embedded Memory  Approximately 2.76 Mbits of on‑chip RAM for buffering, lookup tables, and data storage inside the FPGA fabric.
• I/O Density  210 user I/O pins provide flexible interfacing options for external devices, sensors, and high‑density connectors.
• Power Supply  Core voltage range of 0.95 V to 1.05 V to match system power rails and enable predictable power design.
• Package and Mounting  324‑LFBGA (324‑CSPBGA, 15 × 15 mm) surface‑mount package for space‑conscious board layouts and automated assembly.
• Operational Range and Grade  Commercial grade operation with a specified temperature range of 0 °C to 85 °C.
• RoHS Compliance  Device is RoHS compliant for environmental and manufacturing considerations.

Typical Applications

• Embedded Systems  Implement custom control logic, protocol bridging, or hardware acceleration where programmable logic and on‑chip RAM are required.
• Communications Interfaces  Implement parallel or serial interface logic and I/O buffering using the device’s 210 I/O pins and embedded memory.
• Prototyping and Development  Use the Artix‑7 device to evaluate and iterate digital designs that need moderate logic capacity and flexible I/O.

Unique Advantages

• Balanced Logic and Memory:  52,160 logic elements paired with approximately 2.76 Mbits of embedded RAM enable both control logic and local data storage without external memory in many designs.
• High I/O Count:  210 I/O pins simplify board routing for multi‑signal interfaces and reduce the need for external multiplexing.
• Compact, Assembly‑Friendly Package:  The 324‑LFBGA (15×15 mm) package supports dense PCB layouts and standard surface‑mount manufacturing processes.
• Predictable Power Requirements:  Defined core voltage range (0.95–1.05 V) aids in power supply planning and system integration.
• Commercial Temperature Rating:  Specified operation from 0 °C to 85 °C for designs targeting commercial‑grade environments.
• Regulatory Compliance:  RoHS compliance supports environmentally conscious manufacturing and supply chain requirements.

Why Choose XC7A50T-1CSG324C?

The XC7A50T-1CSG324C combines a substantial logic element count with meaningful on‑chip memory and a large I/O complement in a compact 324‑LFBGA package. It is positioned for designs that require flexible, reconfigurable logic resources and direct interfacing to a wide set of peripherals while adhering to commercial temperature and power constraints.

This device is appropriate for engineering teams and procurement buyers seeking a commercially graded Artix‑7 FPGA option that delivers moderate density, integrated RAM, and robust I/O in a surface‑mount form factor supported by AMD’s Artix‑7 documentation.

Request a quote or submit a product inquiry to obtain pricing, availability, and lead‑time information for the XC7A50T-1CSG324C.