XC7A50T-1CPG236I

IC FPGA 106 I/O 238CSBGA
Part Description

Artix-7 Field Programmable Gate Array (FPGA) IC 106 2764800 52160 238-LFBGA, CSPBGA

Quantity 1,286 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package238-CSBGA (10x10)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case238-LFBGA, CSPBGANumber of I/O106Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4075Number of Logic Elements/Cells52160
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits2764800

Overview of XC7A50T-1CPG236I – Artix-7 Field Programmable Gate Array (FPGA)

The XC7A50T-1CPG236I is an Artix-7 Field Programmable Gate Array (FPGA) IC from AMD, provided in a 238-LFBGA/CSPBGA package for surface-mount assembly. It delivers moderate logic capacity with 52,160 logic elements, approximately 2.76 Mbits of embedded memory, and 106 I/Os, presented in an industrial-grade device rated for operation from -40 °C to 100 °C.

Key Features

  • Logic Capacity  52,160 logic elements suitable for custom digital logic, glue logic, and medium-complexity programmable designs.
  • Embedded Memory  Approximately 2.76 Mbits of on-chip RAM to support buffering, state storage, and on-chip data processing.
  • I/O Count  106 general-purpose I/Os to accommodate a broad set of peripherals and interface requirements.
  • Power  Core voltage supply range of 0.95 V to 1.05 V to match standard low-voltage FPGA core requirements.
  • Package & Mounting  238-LFBGA (238-CSBGA, 10×10) package designed for surface-mount PCB assembly in compact board footprints.
  • Industrial Temperature Range  Rated for operation from −40 °C to 100 °C to meet industrial environment requirements.
  • Compliance  RoHS compliant for regulatory alignment with lead-free manufacturing processes.

Typical Applications

  • Industrial Control  Suited to control and automation applications that require industrial-grade components and extended temperature operation.
  • Embedded Systems and Prototyping  Useful in embedded designs that need roughly 52,160 logic elements and on-chip memory for custom processing and state machines.
  • I/O-Intensive Interfaces  Well-suited for systems requiring 106 I/Os for peripheral connectivity, protocol bridging, or I/O aggregation.

Unique Advantages

  • Moderate Logic Density: 52,160 logic elements provide a balance between capacity and cost for medium-complexity designs.
  • On-Chip Memory Availability: Approximately 2.76 Mbits of embedded RAM reduces external memory dependency for buffering and local data storage.
  • Robust Industrial Operation: −40 °C to 100 °C operating range and industrial grade classification support deployment in demanding environments.
  • Compact BGA Packaging: 238-LFBGA (238-CSBGA, 10×10) enables high-density board layouts while maintaining manufacturability for surface-mount assembly.
  • Low-Voltage Core Compatibility: 0.95 V to 1.05 V supply range aligns with modern low-voltage FPGA core domains for power-aware designs.
  • Manufacturing Compliance: RoHS compliance simplifies integration into lead-free production processes.

Why Choose XC7A50T-1CPG236I?

The XC7A50T-1CPG236I offers a practical combination of logic capacity, embedded memory, and I/O count within an industrial-grade Artix-7 FPGA package. Its specifications make it a fit for developers and procurement teams seeking a surface-mount FPGA that supports moderate digital complexity and extended-temperature operation.

This device is appropriate for designs that prioritize a balance of integration, compact packaging, and industrial robustness, providing predictable on-chip resources for scalable custom logic implementations.

Request a quote or submit an inquiry to obtain pricing and availability for the XC7A50T-1CPG236I.

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