XC7A35T-L2CSG324E
| Part Description |
Artix-7 Field Programmable Gate Array (FPGA) IC 210 1843200 33280 324-LFBGA, CSPBGA |
|---|---|
| Quantity | 224 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 324-CSPBGA (15x15) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 324-LFBGA, CSPBGA | Number of I/O | 210 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2600 | Number of Logic Elements/Cells | 33280 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1843200 |
Overview of XC7A35T-L2CSG324E – Artix-7 FPGA IC, 324-LFBGA
The XC7A35T-L2CSG324E is an Artix-7 field programmable gate array (FPGA) in a 324-LFBGA CSPBGA package. It combines a mid-range logic capacity with on-chip memory and a high I/O count in a compact surface-mount package suited for board-level integration.
Designed for extended-grade operation, this device supports a core supply range of 0.95–1.05 V and an operating temperature range of 0 °C to 100 °C, offering a balance of integration and thermal tolerance for a variety of embedded designs.
Key Features
- FPGA Core – Contains 33,280 logic elements to implement custom digital logic and functions.
- Embedded Memory – Approximately 1.84 Mbits of on-chip RAM for buffering, state storage, and data processing tasks.
- I/O Capacity – 210 user I/Os to support multiple interfaces and board-level connectivity requirements.
- Package and Mounting – 324-LFBGA, CSPBGA supplier package (324-CSPBGA, 15×15); surface-mount mounting type for compact PCB layouts.
- Power – Core voltage supply range of 0.95 V to 1.05 V to match system-level power domains.
- Temperature and Grade – Extended grade device rated for operation from 0 °C to 100 °C.
- Environmental Compliance – RoHS compliant for regulatory and manufacturing requirements.
Typical Applications
- High-density I/O systems – Use the 210 I/Os to consolidate multiple interface signals on a single FPGA for streamlined board designs.
- Embedded logic and control – Leverage 33,280 logic elements to implement custom control, protocol bridging, or data path logic.
- On-chip buffering and data manipulation – Approximately 1.84 Mbits of embedded memory supports packet buffering, FIFOs, and temporary storage for real-time processing.
- Compact board-level solutions – The 324-CSPBGA (15×15) surface-mount package minimizes board area for space-constrained applications.
Unique Advantages
- Substantial logic capacity: 33,280 logic elements provide room to implement complex digital designs without external CPLDs.
- Integrated memory: Approximately 1.84 Mbits of on-chip RAM reduces external memory requirements and simplifies BOM.
- High I/O count: 210 I/Os enable direct connection to multiple peripherals and interfaces, reducing the need for external I/O expanders.
- Compact, manufacturable package: 324-CSPBGA (15×15) surface-mount package supports modern PCB assembly processes and dense layouts.
- Extended-grade operation: Rated for 0 °C to 100 °C, suitable for applications requiring broader-than-commercial temperature tolerance.
- Regulatory readiness: RoHS compliance supports environmentally conscious manufacturing and regulatory requirements.
Why Choose XC7A35T-L2CSG324E?
The XC7A35T-L2CSG324E positions itself as a versatile mid-range Artix-7 FPGA option that balances logic capacity, embedded memory, and I/O density within a compact 324-LFBGA package. Its extended-grade rating and defined core voltage range make it suitable for engineers seeking a reliable platform for embedded logic, interface consolidation, and on-chip data handling.
This device is well suited to designers who need a scalable, board-friendly FPGA solution that simplifies BOM and supports a range of system-level power and thermal envelopes while maintaining environmental compliance.
Request a quote or submit an inquiry to receive pricing and availability for the XC7A35T-L2CSG324E and support for your design requirements.

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