XC7A35T-L2CPG236E
| Part Description |
Artix-7 Field Programmable Gate Array (FPGA) IC 106 1843200 33280 238-LFBGA, CSPBGA |
|---|---|
| Quantity | 961 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 238-CSBGA (10x10) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 238-LFBGA, CSPBGA | Number of I/O | 106 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2600 | Number of Logic Elements/Cells | 33280 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1843200 |
Overview of XC7A35T-L2CPG236E – Artix-7 Field Programmable Gate Array (FPGA) IC, 33,280 logic elements, ~1.84 Mbits RAM, 106 I/Os, 238-LFBGA
The XC7A35T-L2CPG236E is an Artix-7 family Field Programmable Gate Array (FPGA) presented in a 238-ball LFBGA package. It combines a substantial logic fabric with on-chip memory and a moderate I/O count to support custom digital logic implementations.
Key device attributes include 33,280 logic elements, approximately 1.84 Mbits of embedded RAM, 106 general-purpose I/Os, an extended grade operating range of 0 °C to 100 °C, and a core voltage window of 0.95 V to 1.05 V. The device is RoHS compliant and supplied in a surface-mount CSPBGA footprint.
Key Features
- Programmable Logic Fabric 33,280 logic elements provide substantial capacity for custom digital designs and complex logic functions.
- Embedded Memory Approximately 1.84 Mbits of on-chip RAM to support buffering, lookup tables, and localized storage for logic blocks.
- I/O Count 106 general-purpose I/Os suitable for interfacing with sensors, peripherals, and board-level signals.
- Power and Core Voltage Operates with a core supply range of 0.95 V to 1.05 V to match system power domains and design requirements.
- Package and Mounting Supplied in a 238-LFBGA (238-CSBGA, 10×10) package designed for surface-mount assembly.
- Operating Range and Grade Extended grade device rated for an operating temperature range of 0 °C to 100 °C.
- Environmental Compliance RoHS compliant.
Typical Applications
- Custom Digital Logic Implement application-specific state machines, control logic, and timing-critical functions using the device’s logic fabric and embedded memory.
- Embedded System Integration Integrate glue logic, peripheral controllers, and custom interfaces where moderate I/O and on-chip RAM are required.
- Protocol Bridging and Signal Interfacing Use the device’s I/O resources to bridge between different interfaces or to handle protocol conversion tasks.
- Prototyping and Development Evaluate and iterate digital designs that require reconfigurable logic capacity and embedded RAM for early-stage validation.
Unique Advantages
- Balanced Logic and Memory: 33,280 logic elements combined with approximately 1.84 Mbits of RAM provide a balanced resource set for mid-range FPGA designs.
- Practical I/O Count: 106 I/Os allow connection to multiple peripherals and board-level signals without excessive package complexity.
- Compact Surface-Mount Package: The 238-LFBGA CSPBGA footprint supports dense board layouts while remaining suitable for automated assembly.
- Extended Operating Range: Extended grade rating and a 0 °C to 100 °C operating window support deployment in a variety of ambient conditions.
- Controlled Core Voltage: A defined 0.95 V to 1.05 V supply window simplifies power domain planning and integration with regulated power rails.
- RoHS Compliant: Meets lead-free and hazardous substance requirements for environmentally conscious designs.
Why Choose XC7A35T-L2CPG236E?
The XC7A35T-L2CPG236E positions itself as a mid-range Artix-7 FPGA option that delivers a practical mix of logic capacity, embedded RAM, and I/O resources in a compact BGA package. Its extended-grade rating and specified core voltage range make it suitable for designs that need reliable, reconfigurable logic with clearly defined electrical and thermal limits.
This device is well suited for engineers and procurement teams looking to implement custom digital functions, interface bridging, or prototyping on a platform that balances integration and board-space efficiency. The combination of resources and package choices supports scalable designs while maintaining component-level environmental compliance.
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