XC7A50T-3CPG236E

The XC7A50T-3CPG236E is an Artix-7 family Field Programmable Gate Array (FPGA) IC from AMD. It combines a substantial programmable logic capacity with embedded on-chip memory and a 106-pin I/O capability in a compact BGA package.

Designed for systems that require programmable logic, local memory, and flexible I/O in a surface-mount 238-LFBGA (238-CSBGA, 10×10) form factor, this device offers a clear balance of integration, power envelope, and operating temperature coverage for a range of designs.

Key Features

• Programmable Logic Capacity 52,160 logic elements provide the core programmable fabric for custom logic, control, and acceleration tasks.
• Embedded Memory Approximately 2.76 Mbits of on-chip RAM for buffering, state storage, and local data processing.
• I/O Resources 106 user I/O pins to support multiple peripherals and custom interfacing requirements.
• Power Core voltage supply range from 950 mV to 1.05 V to match the device's specified power requirements.
• Package & Mounting 238-LFBGA package (supplier device package: 238-CSBGA, 10×10) with surface-mount mounting for compact PCB integration.
• Operating Range & Grade Rated for operation from 0 °C to 100 °C and specified as Extended grade.
• Environmental Compliance RoHS compliant for regulatory and manufacturing considerations.

Typical Applications

• Programmable Logic Prototyping Use where 52,160 logic elements and embedded memory are needed to validate and iterate custom logic and system designs.
• I/O-Driven Interfaces Apply in designs that require up to 106 I/O for connecting multiple peripherals, sensors, or custom interfaces.
• On-Chip Acceleration and Buffering Utilize the approximately 2.76 Mbits of on-chip RAM for local buffering, small caches, or data-path acceleration within a compact FPGA footprint.

Unique Advantages

• High Logic Density: 52,160 logic elements enable medium-complexity designs without excessive external components.
• Substantial On-Chip Memory: Approximately 2.76 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage needs.
• Flexible I/O Count: 106 I/O pins simplify interfacing across multiple peripherals and custom signals.
• Compact Surface-Mount Package: 238-LFBGA / 238-CSBGA (10×10) packaging supports space-constrained PCB layouts.
• Controlled Power Envelope: Core supply range of 950 mV to 1.05 V aligns with the device's specified power requirements for predictable integration.
• Extended Temperature Grade: Rated 0 °C to 100 °C to accommodate a range of commercial and controlled-environment applications.

Why Choose XC7A50T-3CPG236E?

The XC7A50T-3CPG236E provides a balanced set of capabilities—52,160 logic elements, approximately 2.76 Mbits of embedded memory, and 106 I/O—within a compact 238-LFBGA surface-mount package. These characteristics make it well suited for designs that need significant programmable logic and local memory while maintaining a small PCB footprint.

As an Artix-7 device from AMD, the part is RoHS compliant and specified for extended temperature operation, offering integration and environmental assurances important to procurement and engineering teams focused on reliable, maintainable designs.

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