XC7A50T-2FTG256C

IC FPGA 170 I/O 256FTBGA
Part Description

Artix-7 Field Programmable Gate Array (FPGA) IC 170 2764800 52160 256-LBGA

Quantity 295 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package256-FTBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LBGANumber of I/O170Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4075Number of Logic Elements/Cells52160
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits2764800

Overview of XC7A50T-2FTG256C – Artix-7 Field Programmable Gate Array IC, 256-LBGA

The XC7A50T-2FTG256C is an AMD Artix-7 Field Programmable Gate Array (FPGA) supplied in a 256-LBGA package. It provides a balanced combination of programmable logic, on-chip memory, and I/O density for commercial-grade embedded designs.

With 52,160 logic elements, approximately 2.76 Mbits of embedded memory and 170 user I/O pins, this device is intended for FPGA-based implementations that require significant logic capacity, embedded RAM, and a compact surface-mount BGA footprint.

Key Features

  • Core Logic  52,160 logic elements provide the programmable fabric for implementing custom digital logic and datapaths.
  • Embedded Memory  Approximately 2.76 Mbits of on-chip RAM for buffering, FIFOs, and local storage within the programmable fabric.
  • Input/Output  170 user I/O pins to support multiple interfaces and board-level signal connections.
  • Power  Core voltage supply range of 0.950 V to 1.05 V to match system power rail requirements.
  • Package & Mounting  256-LBGA package (supplier device package: 256-FTBGA, 17×17) designed for surface-mount assembly in space-constrained boards.
  • Operating Conditions  Commercial-grade operation from 0° C to 85° C, suitable for standard commercial applications.
  • Regulatory Compliance  RoHS compliant.

Typical Applications

  • Custom Digital Acceleration  Implement hardware accelerators and custom datapaths using the 52,160 logic elements and on-chip RAM for improved throughput.
  • High-Density I/O Interfaces  Use the 170 I/O pins for bridging between multiple peripheral interfaces or parallel data streams on a compact PCB footprint.
  • Embedded System Control  Integrate control logic and local memory for embedded controllers in commercial electronic products.

Unique Advantages

  • Substantial Logic Capacity: 52,160 logic elements enable complex custom logic implementations without external ASICs.
  • On-Chip Memory: Approximately 2.76 Mbits of embedded RAM reduces dependence on external memory for buffering and local storage.
  • High I/O Count: 170 user I/Os simplify integration of multiple interfaces and peripherals on a single device.
  • Compact BGA Footprint: 256-LBGA / 256-FTBGA (17×17) package supports high-density PCB layouts and surface-mount assembly.
  • Commercial Temperature Rating: Rated for 0° C to 85° C operation to meet standard commercial deployment environments.
  • RoHS Compliant: Meets RoHS requirements for environmentally responsible designs.

Why Choose XC7A50T-2FTG256C?

The XC7A50T-2FTG256C positions itself as a versatile commercial-grade FPGA offering a strong balance of programmable logic, embedded memory, and I/O capacity in a compact 256-LBGA package. It suits designers who need to implement medium-to-large scale custom logic, local data buffering, and multiple interface connections on space-constrained boards.

With a defined core voltage range and commercial operating temperature, the device provides a predictable platform for long-term designs that require scalability and straightforward integration into existing FPGA development flows.

Request a quote or submit a purchase inquiry to obtain pricing, lead-time and ordering information for the XC7A50T-2FTG256C.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1969


    Headquarters: Santa Clara, California, USA


    Employees: 25,000+


    Revenue: $22.68 Billion


    Certifications and Memberships: ISO9001:2015, RoHS, REACH


    Featured Products
    Latest News
    keyboard_arrow_up