XC7A50T-3FGG484E

IC FPGA 250 I/O 484FBGA
Part Description

Artix-7 Field Programmable Gate Array (FPGA) IC 250 2764800 52160 484-BBGA

Quantity 500 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeExtendedOperating Temperature0°C – 100°C
Package / Case484-BBGANumber of I/O250Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs4075Number of Logic Elements/Cells52160
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits2764800

Overview of XC7A50T-3FGG484E – Artix-7 Field Programmable Gate Array (FPGA) IC

The XC7A50T-3FGG484E is an Artix-7 Field Programmable Gate Array (FPGA) in a 484-ball BGA package engineered for programmable logic designs. It combines substantial logic capacity, on-chip memory, and a high I/O count in a surface-mount 484-FBGA (23×23) footprint for compact board-level integration.

Key Features

  • Logic Capacity  Contains 52,160 logic elements, providing a sizeable resource pool for combinational and sequential logic implementation.
  • Embedded Memory  Approximately 2.76 Mbits of total on-chip RAM to support data buffering, FIFOs and small block RAM requirements.
  • I/O Count  250 user I/O pins to enable multiple parallel interfaces, bus connections and peripheral integration.
  • Power Supply  Core voltage supply range from 0.95 V to 1.05 V, enabling adherence to specified core-power requirements.
  • Package & Mounting  484-ball BG A package (484-BBGA / supplier device package 484-FBGA, 23×23) in a surface-mount form factor for dense PCB layouts.
  • Operating Conditions & Grade  Extended grade with an operating temperature range of 0 °C to 100 °C for a variety of embedded and industrial-adjacent environments.

Typical Applications

  • Digital signal processing  Use the device's 52,160 logic elements and on-chip RAM to implement DSP pipelines, custom filtering and data-path acceleration.
  • High-density I/O interfacing  With 250 I/Os, the FPGA suits systems requiring multiple parallel interfaces, protocol bridging or multi-channel data capture.
  • Compact board-level systems  The 484-FBGA (23×23) surface-mount package supports space-constrained PCBs where high integration is needed.
  • Embedded control and buffering  Approximately 2.76 Mbits of embedded memory allow local buffering and state storage for control logic and data staging.

Unique Advantages

  • Substantial logic density: 52,160 logic elements allow implementation of complex custom logic and parallel processing blocks without external glue logic.
  • On-chip memory availability: Approximately 2.76 Mbits of embedded RAM reduces dependence on external memory for many control and buffering functions.
  • High I/O count: 250 I/Os enable broad peripheral connectivity and multi-channel interface designs while simplifying board-level routing.
  • Compact, surface-mount package: The 484-FBGA (23×23) package provides a high-pin-count solution in a small footprint for dense system integration.
  • Controlled core voltage: A defined core supply range of 0.95 V to 1.05 V supports predictable power design and supply planning.
  • Extended operating grade: Rated for 0 °C to 100 °C operation to support a wide range of ambient conditions in embedded deployments.

Why Choose XC7A50T-3FGG484E?

The XC7A50T-3FGG484E positions itself as a high-capacity, board-friendly Artix-7 FPGA option that balances logic resources, embedded memory and a large I/O count in a compact 484-ball surface-mount package. Its specified core voltage range and extended-grade operating temperature make it suitable for diverse embedded designs where integration and predictable electrical/thermal behavior matter.

Designers building systems that require significant programmable logic, on-chip RAM and broad peripheral interfacing will find this device applicable for consolidating functions, reducing external components and streamlining PCB layouts.

Request a quote or submit a pricing inquiry for the XC7A50T-3FGG484E to check availability and lead time for your design requirements.

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