XC7A50T-3CSG325E

The XC7A50T-3CSG325E is an Artix-7 Field Programmable Gate Array (FPGA) provided in a 324‑pin LFBGA / CSPBGA surface‑mount package. It combines a mid‑range logic capacity with embedded memory and a 150‑pin I/O count to support compact, configurable digital designs.

With 4,075 logic blocks, approximately 2.76 Mbits of on‑chip RAM and a 950 mV to 1.05 V supply range, this device is suited for applications that require a balanced mix of logic density, on‑chip memory and flexible I/O in a compact package.

Key Features

• Logic Capacity – 52,160 logic elements across 4,075 logic blocks to implement medium‑complexity digital designs.
• On‑Chip Memory – Approximately 2.76 Mbits of embedded RAM for buffering, packet storage or intermediate data processing.
• I/O – 150 user I/O pins to interface with peripherals, sensors and other digital systems.
• Power – Core voltage supply range of 950 mV to 1.05 V to match system power rails and constraints.
• Package and Mounting – 324‑pin LFBGA / 324‑CSPBGA (15 × 15 mm) supplier device package; surface‑mount package suitable for compact PCB layouts.
• Temperature and Grade – Extended grade with an operating temperature range of 0°C to 100°C for a variety of deployment environments.
• Compliance – RoHS compliant.

Typical Applications

• Embedded Systems – Implement custom logic, data handling and control functions using the device’s logic elements and on‑chip RAM.
• Communications and Connectivity – Use the device’s 150 I/O pins for protocol interfacing, bridging or custom transceiver logic.
• Prototyping and Development – Rapidly iterate hardware designs that require moderate logic density and embedded memory in a compact package.

Unique Advantages

• Balanced Logic and Memory: 52,160 logic elements with approximately 2.76 Mbits of embedded RAM deliver a practical mix of resources for mid‑range designs.
• Generous I/O Count: 150 user I/Os provide flexibility for connecting multiple peripherals and interfaces without external I/O expanders.
• Compact Surface‑Mount Package: 324‑pin LFBGA / CSPBGA (15 × 15 mm) enables high‑density board layouts while keeping component count low.
• Extended Temperature Range: Rated 0°C to 100°C and designated Extended grade to meet broader environmental requirements.
• Regulatory Compliance: RoHS compliance supports use in designs targeting regulated markets and supply chains.

Why Choose XC7A50T-3CSG325E?

The XC7A50T-3CSG325E positions itself as a mid‑range Artix‑7 FPGA option that balances logic capacity, embedded memory and I/O in a compact, surface‑mount 324‑pin package. Its specification set makes it suitable for designs that need configurable hardware resources without moving to larger, higher‑cost devices.

Engineers and procurement teams will value the device for projects that require scalable, reconfigurable logic, a practical amount of on‑chip RAM and a substantial I/O complement—all in an extended‑grade, RoHS‑compliant form factor.

Request a quote or submit an inquiry to receive pricing and availability for XC7A50T-3CSG325E and to discuss how this FPGA can fit into your next design.