XC7S6-2FTGB196I

The XC7S6-2FTGB196I is a Spartan®-7 FPGA IC offering a compact, surface-mount solution for industrial-grade embedded designs. It integrates approximately 6,000 logic elements, roughly 0.18 Mbits of embedded RAM, and 100 user I/O in a 196-LBGA (15 × 15 mm) package.

Designed for applications that require low-voltage core operation and extended temperature range, this device supports supply voltages from 0.95 V to 1.05 V and operation from −40 °C to 100 °C, making it suitable for a range of space-constrained and industrial environments.

Key Features

• Core Logic  Approximately 6,000 logic elements to implement combinational and sequential logic for control, glue logic, and moderate-density processing tasks.
• Embedded Memory  Approximately 184,320 bits (≈0.18 Mbits) of on-chip RAM for buffering, FIFOs, and small data stores close to logic.
• I/O Count  100 user I/O pins to interface with peripherals, sensors, and external logic in compact systems.
• Power Envelope  Core supply range of 0.95 V to 1.05 V for low-voltage FPGA core operation.
• Package & Mounting  196-LBGA, CSPBGA package (supplier package: 196-CSBGA, 15×15 mm) optimized for surface-mount assembly in compact PCBs.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C to meet thermal requirements in industrial and ruggedized applications.
• Standards Compliance  RoHS-compliant construction for regulatory alignment in many regions.

Typical Applications

• Industrial Control & Automation  Use as a programmable logic element for machine control, PLC companion logic, and signal conditioning where extended temperature operation is required.
• Embedded System Integration  Implement custom interfaces, glue logic, or offload deterministic tasks in compact embedded platforms using the 100 I/O pins and on-chip memory.
• Compact & Space-Constrained Designs  The 196-LBGA (15×15 mm) package provides a small footprint for applications that need FPGA capability without large board area.
• Sensor Aggregation and Preprocessing  Aggregate and preprocess sensor data close to the source using on-chip logic and RAM before handing off to a host processor.

Unique Advantages

• Compact BGA Package: The 196-LBGA (15×15 mm) footprint enables FPGA integration in space-limited PCBs while preserving signal routing options.
• Industrial Temperature Range: Guaranteed operation from −40 °C to 100 °C supports deployment in demanding ambient conditions.
• Balanced Logic & Memory: Approximately 6,000 logic elements paired with about 0.18 Mbits of embedded RAM provide a practical balance for control and buffering tasks.
• Generous I/O Count: 100 user I/O pins simplify direct interfacing to peripherals, sensors, and external logic without additional bridge chips.
• Low-Voltage Core: Core supply between 0.95 V and 1.05 V supports designs targeting low-voltage FPGA operation and power-sensitive applications.
• RoHS Compliance: Environmentally compliant materials ease regulatory considerations in many markets.

Why Choose XC7S6-2FTGB196I?

The XC7S6-2FTGB196I positions itself as a compact, industrial-grade FPGA option for designers who need a moderate amount of programmable logic, embedded RAM, and a substantial I/O count in a small surface-mount package. Its low-voltage core and extended temperature range make it appropriate for embedded and industrial applications that require reliable operation across temperature extremes.

This device is well suited to engineers building small-form-factor control boards, sensor interfaces, or space-constrained embedded systems that benefit from integrated logic, memory, and a high I/O density. Its RoHS compliance and standard BGA packaging simplify manufacturing and deployment in volume designs.

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