XC7S6-L1CSGA225I

The XC7S6-L1CSGA225I is a Spartan®-7 Field Programmable Gate Array (FPGA) IC in a compact 225-LFBGA (13 × 13) CSPBGA package. It delivers 6,000 logic elements, approximately 0.18 Mbits of embedded memory, and up to 100 I/O, targeted for industrial embedded designs that require programmable logic in a small-footprint, surface-mount form factor.

With an industrial operating temperature range and a low-voltage supply window, this device is suited to industrial and embedded applications where reliable logic integration, controlled power requirements, and board-level density are priorities.

Key Features

• Logic Capacity 6,000 logic elements provide the programmable fabric for implementing custom logic, state machines, and glue-logic functions.
• Embedded Memory Approximately 0.18 Mbits of on-chip RAM for data buffering, small FIFOs, and register storage close to logic resources.
• I/O Count Up to 100 general-purpose I/O pins to interface with peripherals, sensors, and external devices.
• Power Supply Operates from a core voltage supply range of 920 mV to 980 mV, allowing designs optimized for the device’s specified power envelope.
• Package & Mounting 225-LFBGA (13 × 13) CSPBGA package in a surface-mount configuration for high-density PCB integration.
• Industrial Grade & Temperature Range Rated for industrial use with an operating temperature range of –40 °C to 100 °C to meet demanding environmental conditions.
• RoHS Compliant Manufactured in compliance with RoHS requirements for restricted substances.

Typical Applications

• Industrial Control — Implement control logic and deterministic state machines using the device’s logic elements and industrial temperature rating.
• Embedded Systems — Integrate custom glue logic and small on-chip memory for compact embedded designs requiring up to 100 I/O.
• Interface and I/O Expansion — Use the available I/O to bridge peripherals or add protocol-specific interfacing in space-constrained boards.

Unique Advantages

• Compact BGA Package: The 225-LFBGA (13 × 13) CSPBGA footprint reduces board area while providing ample I/O for dense designs.
• Industrial Temperature Capability: Rated from –40 °C to 100 °C, enabling deployment in harsher operating environments.
• Balanced Logic and Memory: Combines 6,000 logic elements with on-chip memory to support modest logic implementations with local buffering.
• Low-Voltage Core Operation: Core supply of 920 mV to 980 mV supports designs targeting specific low-voltage power rails.
• RoHS Compliance: Conforms to RoHS requirements for environmentally restricted substances.

Why Choose XC7S6-L1CSGA225I?

The XC7S6-L1CSGA225I positions itself as a practical solution for industrial and embedded designs that require programmable logic in a small, surface-mount BGA package. Its mix of 6,000 logic elements, on-chip memory, and up to 100 I/O enables designers to consolidate glue logic, interface functions, and modest custom logic into a single device while maintaining an industrial operating temperature window.

This AMD Spartan®-7 device is suited to projects where board space, controlled power supply requirements, and reliable operation across a wide temperature range are key considerations. Its combination of features offers a clear path for integrating configurable logic into robust embedded systems.

Request a quote or submit a pricing inquiry to obtain availability and lead-time information for the XC7S6-L1CSGA225I. Our team can provide detailed ordering and delivery options tailored to your project needs.