XC7S75-1FGGA484Q

The XC7S75-1FGGA484Q is a Spartan®-7 field programmable gate array (FPGA) IC from AMD. It provides a balance of programmable logic capacity, embedded memory, and I/O density for designs that require on-chip customization and system integration.

With 76,800 logic elements, approximately 4.33 Mbits of embedded memory and 338 I/O, this device targets applications that need substantial logic and memory resources in a compact surface-mount 484-BGA package. Designed and qualified for automotive use, it supports operation across a wide temperature range and a low-voltage core supply.

Key Features

• Core Logic — 76,800 logic elements provide a large amount of programmable logic capacity for combinational and sequential designs.
• Embedded Memory — Approximately 4.33 Mbits of on-chip RAM for buffering, FIFOs, and data storage close to logic.
• I/O Density — 338 I/O pins to support multiple interfaces, sensor connections, and peripheral integration.
• Power and Voltage — Core voltage supply range of 0.95 V to 1.05 V for low-voltage operation.
• Automotive Qualification — AEC-Q100 qualification and an automotive grade designation for use in vehicle applications.
• Temperature Range — Rated for operation from –40 °C to 125 °C to meet demanding thermal environments.
• Package and Mounting — 484-BGA package (supplier device package: 484-FPBGA, 23×23) in a surface-mount form factor for compact PCB implementations.
• RoHS Compliant — Meets RoHS environmental requirements.

Typical Applications

• Automotive Control Systems — Use for in-vehicle logic integration, sensor aggregation and control functions where AEC-Q100 qualification and extended temperature operation are required.
• Embedded Signal Processing — Implement custom data paths, protocol handling, and preprocessing using the device’s logic and on-chip RAM.
• Interface Bridging and Aggregation — High I/O count supports aggregation of multiple peripheral interfaces and bridging between subsystems.
• Compact System Integration — Surface-mount 484-BGA package enables dense PCB layouts for space-constrained applications.

Unique Advantages

• Significant Logic Capacity: 76,800 logic elements allow complex hardware functions and custom accelerators to be implemented on-chip, reducing external components.
• Substantial On-Chip Memory: Approximately 4.33 Mbits of embedded RAM supports buffering and data-intensive operations without relying on external memory.
• High I/O Count: 338 I/O pins provide flexibility for connecting sensors, peripherals, and communication interfaces directly to the FPGA.
• Automotive-Grade Qualification: AEC-Q100 qualification and an automotive grade designation provide documented reliability for vehicle deployments.
• Wide Operating Temperature: Rated from –40 °C to 125 °C for use in thermally challenging environments.
• Compact BGA Packaging: 484-BGA (23×23) surface-mount package enables compact, high-density board designs while maintaining robust connectivity.
• Low-Voltage Core Operation: Core supply range of 0.95 V to 1.05 V supports low-voltage system architectures.

Why Choose XC7S75-1FGGA484Q?

The XC7S75-1FGGA484Q combines a large programmable logic fabric, meaningful on-chip memory, and a high I/O count in a compact 484-BGA package, offering a practical solution for designs that require integration, configurability, and automotive-level reliability. Its AEC-Q100 qualification and wide operating temperature range make it suited to vehicle electronics and other demanding environments where robustness matters.

This device is well suited for engineers and teams building systems that need scalable logic resources, substantial embedded memory, and flexible I/O in a surface-mount form factor—delivering integration that can reduce board-level complexity and support long-term deployment in temperature-challenging applications.

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