XC7S75-1FGGA676I

The XC7S75-1FGGA676I is a Spartan®-7 Field Programmable Gate Array (FPGA) IC from AMD, offering a high-density programmable logic fabric in an industrial-grade device. It combines a large number of logic elements with substantial on-chip RAM and a high I/O count to address demanding embedded and industrial applications.

With 76,800 logic elements, approximately 4.33 Mbits of embedded memory, and up to 400 I/O pins in a 676-ball BGA package, this device is suited to designs that require dense logic implementation, significant internal buffering, and a broad external interface set, while operating across an industrial temperature range.

Key Features

• Core Logic  Approximately 76,800 logic elements implemented across 6,000 configurable logic resources for complex combinational and sequential designs.
• Embedded Memory  Approximately 4.33 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage without external memory.
• I/O Capacity  Up to 400 I/O pins to support extensive peripheral interfacing and multiple parallel interfaces.
• Power Supply  Core voltage range specified at 0.950 V to 1.05 V to match system power-rail design requirements.
• Package & Mounting  676-BGA (supplier package: 676-FPBGA, 27 × 27 mm) in a surface-mount form factor for compact board integration.
• Industrial Temperature Range  Rated for operation from –40 °C to 100 °C for reliable performance in industrial environments.
• RoHS Compliant  Meets RoHS requirements for lead-free manufacturing and environmental compliance.

Typical Applications

• Industrial Control  Leverage the industrial temperature rating and large logic capacity to implement control logic and deterministic processing in factory and process automation equipment.
• I/O-Intensive Systems  Use the 400 I/O pins to interface with numerous sensors, actuators, or external devices requiring parallel or multiplexed connections.
• Memory-Dependent Logic  Deploy internal buffering and temporary storage using approximately 4.33 Mbits of embedded RAM for data streaming, packet buffering, or local caching functions.
• Compact Board Designs  The 676-FPBGA (27 × 27 mm) package enables high-density integration where PCB space is constrained but substantial logic and I/O are required.

Unique Advantages

• High Logic Density: 76,800 logic elements support complex design implementations without immediate need for multiple FPGAs.
• Substantial On-Chip Memory: Approximately 4.33 Mbits of embedded RAM reduces dependence on external memory and simplifies timing and board-level routing.
• Large I/O Count: 400 I/Os simplify system-level integration by accommodating numerous peripherals and interfaces directly.
• Industrial Reliability: Specified operation from –40 °C to 100 °C aligns the device with robust industrial deployment requirements.
• Compact, Surface-Mount Package: The 676-BGA (676-FPBGA, 27 × 27) provides a balance of pin count and PCB area efficiency for space-constrained designs.
• Compliance-Ready: RoHS compliance supports environmentally conscious manufacturing and regulatory needs.

Why Choose XC7S75-1FGGA676I?

The XC7S75-1FGGA676I positions itself as a high-density, industrial-grade Spartan®-7 FPGA option that combines significant logic resources, on-chip memory, and extensive I/O in a compact BGA package. These characteristics make it suitable for engineering teams building robust embedded systems and industrial equipment that demand deterministic programmable logic and broad interfacing capability.

Engineers choosing this part gain a device designed for long-term value through integration of logic, memory, and I/O while meeting industrial temperature and RoHS requirements. Its specifications support scalable designs where board space, power rails, and environmental tolerance are key considerations.

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