XC7S75-2FGGA676C

The XC7S75-2FGGA676C is a Spartan®-7 Field Programmable Gate Array (FPGA) offered in a 676-ball BGA package. It provides a balance of logic capacity, embedded memory, and I/O density for commercial-grade FPGA designs.

Designed for surface-mount assembly, this device targets applications that require significant on-chip logic and memory resources while operating within a 0 °C to 85 °C temperature range and a core supply of 0.95 V to 1.05 V.

Key Features

• Logic Capacity — Offers 76,800 logic elements and 6,000 CLBs to implement complex programmable logic and custom digital functions.
• Embedded Memory — Approximately 4.33 Mbits of on-chip RAM for buffering, packet storage, and memory-mapped logic structures.
• I/O Density — Up to 400 I/O pins to support broad external connectivity and high-pin-count interfaces.
• Package & Mounting — 676-BGA package format (supplier package: 676-FPBGA, 27×27) optimized for compact board-level integration and surface-mount assembly.
• Power — Core voltage supply range from 0.95 V to 1.05 V to match low-voltage FPGA power domains.
• Temperature & Grade — Commercial grade device rated for operation from 0 °C to 85 °C.
• Compliance — RoHS compliant for environmental and regulatory adherence.

Typical Applications

• Custom digital logic and prototyping — Implement and iterate complex logic designs using the device’s 76,800 logic elements and 6,000 CLBs for hardware validation and development platforms.
• High-density I/O interfacing — Leverage up to 400 I/O pins to bridge multiple peripherals, sensors, and external controllers in board-level systems.
• Memory-centric embedded functions — Use approximately 4.33 Mbits of embedded RAM for buffering, packet handling, and temporary storage in embedded applications.

Unique Advantages

• Substantial logic resources: 76,800 logic elements and 6,000 CLBs provide headroom for complex, parallel logic implementations without external gate arrays.
• Integrated on-chip memory: Approximately 4.33 Mbits of RAM reduces dependence on external memory for many buffering and staging tasks, simplifying board design.
• High I/O count: Up to 400 I/O pins enable flexible interfacing to a wide range of peripherals and high-pin-count connectors.
• Compact BGA footprint: 676-BGA (676-FPBGA, 27×27) balances pin density and board space for efficient PCB real estate usage.
• Low-voltage operation: Core supply window of 0.95 V to 1.05 V aligns with modern low-voltage power rails, supporting efficient power distribution designs.
• RoHS compliance: Environmentally compliant manufacturing and disposal considerations are addressed out of the box.

Why Choose XC7S75-2FGGA676C?

The XC7S75-2FGGA676C positions itself as a commercially graded Spartan‑7 FPGA that brings together significant logic density, embedded memory, and a high I/O count in a compact 676-BGA package. Its specified operating voltage and temperature range make it suitable for a wide range of commercial embedded designs that require on-chip resources and flexible interfacing.

This device is a fit for engineers and teams developing prototype systems or production boards where moderate-to-high logic capacity, integrated RAM, and a dense I/O complement help reduce bill-of-materials and simplify board integration. Its RoHS compliance and standard surface-mount package support mainstream manufacturing workflows.

Request a quote for the XC7S75-2FGGA676C to check current pricing and availability or to begin a procurement inquiry.