XC7S75-L1FGGA676I

The XC7S75-L1FGGA676I is a Spartan®-7 Field Programmable Gate Array (FPGA) manufactured by AMD, provided in a 676-ball BGA package (676-FPBGA, 27×27). It offers a combination of logic capacity, on-chip memory and a large I/O count suitable for compact, industrial-grade designs.

With 76,800 logic elements, approximately 4.33 Mbits of embedded memory and 400 user I/Os, this device targets applications that require significant programmable logic, embedded RAM and extensive signal connectivity while operating across a wide industrial temperature range.

Key Features

• Core Logic — 76,800 logic elements provide a substantial fabric for implementing custom digital logic, state machines and combinational/sequential designs.
• Embedded Memory — Approximately 4.33 Mbits of on-chip RAM for buffering, FIFOs and local data storage without external memory.
• I/O Capacity — 400 user I/Os support dense signal interfacing and multi-channel connectivity in a single device.
• Power Supply — Supported voltage supply range from 920 mV to 980 mV for core operation, enabling predictable power planning.
• Package — 676-BGA (676-FPBGA, 27×27) surface-mount package for high pin-count, compact board-level integration.
• Temperature and Grade — Industrial-grade device rated for operation from −40 °C to 100 °C for deployment in temperature-demanding environments.
• Mounting and Compliance — Surface-mount package with RoHS compliance for modern assembly and environmental requirements.

Typical Applications

• Industrial Control: Use the industrial-grade operating range and robust I/O count to implement control logic, signal conditioning and interface consolidation in automation equipment.
• Custom Digital Logic: Implement bespoke state machines, protocol handling and glue logic where 76,800 logic elements and embedded RAM provide local compute resources.
• I/O-Intensive Systems: Consolidate multiple interfaces and high-pin-count signaling in a single package thanks to 400 user I/Os, reducing board-level complexity.
• Embedded Memory-Dependent Designs: Leverage approximately 4.33 Mbits of on-chip RAM for buffering, temporary storage and data path acceleration without immediate external memory needs.

Unique Advantages

• High Logic Density: 76,800 logic elements enable complex designs and feature-rich implementations without multiple devices.
• Significant On-Chip RAM: Approximately 4.33 Mbits of embedded memory reduces dependency on off-chip RAM and simplifies board design.
• Large I/O Resource: 400 user I/Os allow extensive external connectivity and multi-channel interfacing from a single FPGA.
• Industrial Thermal Range: Rated for −40 °C to 100 °C operation to meet the needs of temperature-challenging deployments.
• Compact High-Pin Package: 676-FPBGA (27×27) provides a high pin count in a space-efficient surface-mount form factor.
• RoHS Compliant: Meets environmental compliance expectations for modern electronic assemblies.

Why Choose XC7S75-L1FGGA676I?

The XC7S75-L1FGGA676I positions itself as a versatile Spartan-7 FPGA option for designs that require a balance of logic capacity, on-chip memory and extensive I/O in a compact BGA package. Its industrial-grade temperature rating and RoHS compliance make it suitable for professional applications where environmental range and regulatory adherence matter.

Engineers and procurement teams looking for a single-device solution to consolidate interfaces, implement substantial custom logic, and leverage embedded RAM will find this FPGA aligns with those needs while providing predictable core voltage requirements and a high-density package for space-constrained boards.

If you would like pricing, availability or a formal quote for the XC7S75-L1FGGA676I, submit a request or inquiry and our team will respond with the next steps.