XC7V2000T-2FHG1761C

IC FPGA 850 I/O 1761FCBGA
Part Description

Virtex-7 FPGA, XC7V2000T, 1,954,560 Logic Cells, 2160 DSP, FHG1761, Commercial

Quantity 1,323 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device PackageFHG1761GradeN/AOperating Temperature0°C – 85°C
Package / Case1761-BGANumber of I/O1200Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceCompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4Number of LABs/CLBs1221600Number of Logic Elements/Cells1954560
Number of GatesN/AECCNEAR99HTS Code8542.31.00.60
QualificationN/ATotal RAM Bits47628288

Overview of XC7V2000T-2FHG1761C – Virtex®-7 T Field Programmable Gate Array, 1760-BBGA FCBGA

The XC7V2000T-2FHG1761C is a Virtex®-7 T Field Programmable Gate Array (FPGA) IC manufactured by AMD. It delivers a very large programmable fabric with 1,954,560 logic elements and substantial on-chip memory for complex, high-density logic implementations.

Key device attributes include approximately 47.6 Mbits of embedded memory, 850 I/O pins, a surface-mount FCBGA package, a core voltage supply range of 970 mV to 1.03 V, and commercial-grade operation from 0°C to 85°C. The device is RoHS compliant.

Key Features

  • Core logic  1,954,560 logic elements provide a large programmable resource for complex digital designs.
  • Embedded memory  Approximately 47.6 Mbits (47,628,288 bits) of on-chip RAM to support buffering, intermediate storage, and memory-intensive logic functions.
  • I/O density  850 I/O pins enable broad external connectivity and complex interfacing options.
  • Power and supply  Core voltage supply range of 970 mV to 1.03 V to match target system power configurations.
  • Package and mounting  1760-BBGA, FCBGA package; supplier device package listed as 1761-FCBGA (45×45). Surface-mount mounting type for board-level assembly.
  • Operating range and grade  Commercial grade operation with an operating temperature range of 0°C to 85°C.
  • Environmental compliance  RoHS compliant.

Unique Advantages

  • High logic capacity: The 1,954,560 logic elements support large-scale, highly parallel designs without external logic expansion.
  • Significant on-chip memory: Approximately 47.6 Mbits of embedded RAM reduces the need for external memory for many buffering and storage tasks.
  • Extensive external connectivity: 850 I/O pins enable integration with numerous peripherals and high-pin-count interfaces.
  • Compact surface-mount FCBGA: The 1760-BBGA/1761-FCBGA package offers a high-density footprint suitable for PCB integration where space and pin count matter.
  • Defined power envelope: A specified core supply range (970 mV–1.03 V) supports controlled power design and supply planning.
  • Commercial readiness and compliance: Commercial operating temperature range and RoHS compliance simplify regulatory and lifecycle planning for non-automotive applications.

Why Choose XC7V2000T-2FHG1761C?

The XC7V2000T-2FHG1761C positions itself as a high-capacity, commercial-grade FPGA option for designs that require very large programmable logic resources, abundant embedded RAM, and extensive I/O. Its surface-mount FCBGA package and defined core supply range support careful board-level and power-system integration.

Manufactured by AMD and provided with RoHS compliance, this device is suited for complex digital systems where high logic density and on-chip memory reduce reliance on external components and simplify system architecture.

Request a quote or submit an inquiry to receive pricing and lead-time information for the XC7V2000T-2FHG1761C.

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