XC7V2000T-2FHG1761C
| Part Description |
Virtex-7 FPGA, XC7V2000T, 1,954,560 Logic Cells, 2160 DSP, FHG1761, Commercial |
|---|---|
| Quantity | 1,323 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | FHG1761 | Grade | N/A | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1761-BGA | Number of I/O | 1200 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 | Number of LABs/CLBs | 1221600 | Number of Logic Elements/Cells | 1954560 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.31.00.60 | ||
| Qualification | N/A | Total RAM Bits | 47628288 |
Overview of XC7V2000T-2FHG1761C – Virtex®-7 T Field Programmable Gate Array, 1760-BBGA FCBGA
The XC7V2000T-2FHG1761C is a Virtex®-7 T Field Programmable Gate Array (FPGA) IC manufactured by AMD. It delivers a very large programmable fabric with 1,954,560 logic elements and substantial on-chip memory for complex, high-density logic implementations.
Key device attributes include approximately 47.6 Mbits of embedded memory, 850 I/O pins, a surface-mount FCBGA package, a core voltage supply range of 970 mV to 1.03 V, and commercial-grade operation from 0°C to 85°C. The device is RoHS compliant.
Key Features
- Core logic 1,954,560 logic elements provide a large programmable resource for complex digital designs.
- Embedded memory Approximately 47.6 Mbits (47,628,288 bits) of on-chip RAM to support buffering, intermediate storage, and memory-intensive logic functions.
- I/O density 850 I/O pins enable broad external connectivity and complex interfacing options.
- Power and supply Core voltage supply range of 970 mV to 1.03 V to match target system power configurations.
- Package and mounting 1760-BBGA, FCBGA package; supplier device package listed as 1761-FCBGA (45×45). Surface-mount mounting type for board-level assembly.
- Operating range and grade Commercial grade operation with an operating temperature range of 0°C to 85°C.
- Environmental compliance RoHS compliant.
Unique Advantages
- High logic capacity: The 1,954,560 logic elements support large-scale, highly parallel designs without external logic expansion.
- Significant on-chip memory: Approximately 47.6 Mbits of embedded RAM reduces the need for external memory for many buffering and storage tasks.
- Extensive external connectivity: 850 I/O pins enable integration with numerous peripherals and high-pin-count interfaces.
- Compact surface-mount FCBGA: The 1760-BBGA/1761-FCBGA package offers a high-density footprint suitable for PCB integration where space and pin count matter.
- Defined power envelope: A specified core supply range (970 mV–1.03 V) supports controlled power design and supply planning.
- Commercial readiness and compliance: Commercial operating temperature range and RoHS compliance simplify regulatory and lifecycle planning for non-automotive applications.
Why Choose XC7V2000T-2FHG1761C?
The XC7V2000T-2FHG1761C positions itself as a high-capacity, commercial-grade FPGA option for designs that require very large programmable logic resources, abundant embedded RAM, and extensive I/O. Its surface-mount FCBGA package and defined core supply range support careful board-level and power-system integration.
Manufactured by AMD and provided with RoHS compliance, this device is suited for complex digital systems where high logic density and on-chip memory reduce reliance on external components and simplify system architecture.
Request a quote or submit an inquiry to receive pricing and lead-time information for the XC7V2000T-2FHG1761C.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








