XC7V585T-1FF1157I

The XC7V585T-1FF1157I is a Virtex‑7 T FPGA in a surface‑mount FCBGA package designed for applications that require large programmable logic capacity and substantial on‑chip memory. With a broad operating temperature range and an industrial grade designation, it is presented for designs that need high integration density, extensive I/O, and robust operating conditions.

Key Features

• Logic Capacity  Approximately 582,720 logic elements provide large-scale programmable logic resources for complex digital designs.
• Configurable Logic Blocks  High internal resource count to implement sizable custom logic functions and datapaths.
• Embedded Memory  Approximately 29.3 Mbits of embedded memory for buffering, FIFOs, and on‑chip data storage.
• I/O Resources  600 user I/O pins to support dense connectivity to external devices and interfaces.
• Package and Mounting  1156‑BBGA FCBGA package (supplier device package listed as 1157‑FCBGA, 35×35) in a surface‑mount form factor for board‑level integration.
• Power Supply  Core voltage supply range of 970 mV to 1.03 V to match system power design requirements.
• Temperature Range  Operational range from −40 °C to 100 °C, aligned with industrial deployment conditions.
• RoHS Compliance  RoHS compliant for regulated market and manufacturing requirements.

Typical Applications

• Industrial Control and Automation  Industrial‑grade operation and a −40 °C to 100 °C temperature range enable deployment in factory automation, motor control, and PLC systems that require reliable logic and memory resources.
• High‑density Digital Processing  Large logic element count and substantial embedded memory support complex signal processing, packet processing, and algorithm acceleration tasks.
• I/O‑intensive Systems  With 600 user I/O pins, the device is suited for designs requiring extensive external connectivity, such as multi‑lane data aggregation or large sensor arrays.

Unique Advantages

• Large On‑chip Logic Capacity:  Approximately 582,720 logic elements let designers implement complex, integrated digital subsystems on a single device, reducing component count.
• Significant Embedded Memory:  Around 29.3 Mbits of RAM supports on‑chip buffering and data handling without immediate dependence on external memory.
• High Pin Count for Connectivity:  600 I/O pins enable flexible interfacing and simplify board routing by consolidating signals into one package.
• Industrial Temperature and Grade:  Rated for −40 °C to 100 °C and listed as industrial grade for use in environments with wider temperature and reliability demands.
• Surface‑mount FCBGA Packaging:  1156‑BBGA / 1157‑FCBGA (35×35) packaging supports compact board layouts and high‑density system integration.
• Regulatory Compliance:  RoHS compliance assists with adherence to environmental manufacturing requirements.

Why Choose XC7V585T-1FF1157I?

The XC7V585T-1FF1157I combines a very large logic element count, substantial embedded memory, and a 600‑pin I/O envelope in a compact FCBGA package, making it suitable for designers who need high integration density in industrial environments. Its specified core voltage range and broad operating temperature band support reliable operation within system power and thermal constraints.

This device is appropriate for development teams targeting scalable, logic‑heavy implementations that benefit from on‑chip memory and extensive connectivity, offering a balance of integration and environmental robustness for long‑lifecycle industrial designs.

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