XC7V585T-1FFG1157I

The XC7V585T-1FFG1157I is a Field Programmable Gate Array (FPGA) offering substantial programmable logic capacity, on-chip memory, and a high I/O count in a ball-grid array package. It is supplied as an industrial-grade, surface-mount FCBGA device with electrical and thermal characteristics intended for demanding embedded and system-level designs.

With hundreds of thousands of logic elements, tens of megabits of embedded RAM, and 600 user I/Os, this device targets designs that require large-scale programmable logic resources combined with significant I/O and embedded memory capacity.

Key Features

• Core Logic — Approximately 582,720 logic elements provide substantial programmable logic capacity for large designs.
• Configurable Logic Blocks (CLBs) — 45,525 CLBs to structure and organize logic functions across the device.
• Embedded Memory — Approximately 29.3 Mbits of on-chip RAM for buffering, data storage, and memory-centric processing.
• I/O Resources — 600 user I/Os to support high-density interfacing and multiple external connections.
• Power Supply Range — Operates with a core supply in the range of 970 mV to 1.03 V for core power planning and thermal design.
• Package & Mounting — Provided in 1156-BBGA FCBGA package; supplier device package listed as 1157-FCBGA (35×35). Surface mount mounting type.
• Operating Temperature & Grade — Industrial grade device rated for operation from -40°C to 100°C.
• RoHS Compliant — Meets RoHS environmental requirements for lead-free manufacturing and compliance-driven designs.

Typical Applications

• Custom hardware acceleration — Large logic element count and embedded RAM enable implementation of application-specific accelerators and datapaths.
• High-density I/O systems — 600 user I/Os support complex interface requirements and multi-channel connectivity.
• Memory-intensive processing — Approximately 29.3 Mbits of on-chip RAM for buffering, FIFOs, and local data storage in real-time processing flows.
• Industrial control and automation — Industrial temperature rating and surface-mount FCBGA packaging suit a range of industrial embedded systems.

Unique Advantages

• High programmable capacity: Hundreds of thousands of logic elements and tens of megabits of RAM provide headroom for complex, integrated designs.
• Large I/O complement: 600 user I/Os allow direct interfacing to multiple peripherals, sensors, and external memory interfaces without immediate need for expansion chips.
• Industrial operating range: Rated from -40°C to 100°C for deployment in temperature-challenging environments.
• Compact, surface-mount package: FCBGA package options (1156-BBGA; supplier 1157-FCBGA 35×35) enable high-density board integration while supporting robust thermal and routing strategies.
• RoHS compliant: Supports lead-free manufacturing processes and regulatory compliance requirements.

Why Choose XC7V585T-1FFG1157I?

The XC7V585T-1FFG1157I delivers a combination of large-scale programmable logic, substantial embedded memory, and extensive I/O in an industrial-grade FCBGA package. This balance of resources supports designs that require significant on-chip computation, buffering, and interfacing capacity while meeting temperature and environmental compliance needs.

It is well suited for engineering teams building complex embedded systems that demand scalability of logic and memory resources, high I/O density, and the supply-chain and compliance characteristics associated with RoHS and industrial-grade components.

Request a quote or submit your requirements to get pricing and availability for the XC7V585T-1FFG1157I.