XC7V585T-2FFG1761C

The XC7V585T-2FFG1761C is a Virtex®-7 T field programmable gate array by AMD, delivered in a high-density FCBGA package. It provides large programmable logic capacity and extensive I/O for commercial applications that require high logic density and significant on-chip memory within a surface-mount BGA form factor.

Key Features

• Programmable Logic Capacity  Includes 582,720 logic elements to implement complex digital designs and large-scale logic functions.
• Embedded Memory  Approximately 29.3 Mbits of on-chip RAM to support buffering, state storage, and data processing close to logic.
• I/O Resources  Up to 850 user I/O pins to support extensive interfacing and parallel connections to external devices.
• Power Range  Core supply voltage range from 970 mV to 1.03 V for defined power planning and supply design.
• Package and Mounting  Delivered in a 1760-BBGA, FCBGA package; supplier device package is 1761-FCBGA with a 42.5×42.5 mm footprint, for surface-mount assembly.
• Operating Conditions & Grade  Commercial-grade device with an operating temperature range of 0 °C to 85 °C.
• Compliance  RoHS compliant for regulatory environmental requirements.

Typical Applications

• High-density digital processing  Implement large custom logic blocks and complex state machines using the device's 582,720 logic elements and substantial embedded memory.
• I/O-intensive systems  Leverage up to 850 I/O pins to connect multiple peripherals, sensors, and high-channel-count interfaces.
• System integration and prototyping  Surface-mount FCBGA packaging and abundant resources make the device suitable for integrating multiple functions onto a single programmable chip during development and evaluation.

Unique Advantages

• High logic density: Large logic element count enables consolidation of complex functions and reduces the need for external logic chips.
• Substantial embedded memory: Approximately 29.3 Mbits of on-chip RAM reduces external memory dependency for buffering and state storage.
• Extensive I/O capacity: 850 I/O pins support broad connectivity options and parallel interfacing requirements.
• Compact, industry-standard package: 1760-BBGA / 1761-FCBGA (42.5×42.5 mm) provides a high-density footprint for surface-mount assembly.
• Commercial readiness: Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial deployments.

Why Choose XC7V585T-2FFG1761C?

The XC7V585T-2FFG1761C positions itself as a high-capacity, commercial-grade FPGA solution for designs that require extensive programmable logic, significant embedded memory, and a large number of I/O. Its FCBGA package and surface-mount form factor support dense board-level integration while the defined core voltage range and operating temperature window enable predictable power and thermal planning.

This part is well suited for teams building complex digital systems that need scalability in logic and memory resources, combined with broad interfacing capability. Its combination of resources and packaging offers a clear path for consolidating multiple functions into a single programmable device for commercial applications.

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