XC7V585T-3FFG1761E

The XC7V585T-3FFG1761E is a Virtex®-7 T Field Programmable Gate Array in a 1760-BBGA FCBGA package designed for high-density, reconfigurable logic implementations. It provides a large on-chip resource set including 582,720 logic elements, approximately 29.3 Mbits of embedded memory, and 850 I/O to address complex system integration and custom hardware functions.

Built for surface-mount assembly and specified for an operating temperature range of 0 °C to 100 °C with an extended grade, this device suits applications that require significant logic capacity, abundant I/O, and a compact 42.5 mm × 42.5 mm FCBGA package footprint. The device supply range is specified from 970 mV to 1.03 V and it is RoHS compliant.

Key Features

• Core Capacity 582,720 logic elements provide extensive programmable fabric for large-scale custom logic, parallel datapaths, and complex finite-state implementations.
• Embedded Memory Approximately 29.3 Mbits of on-chip RAM for buffering, packet storage, and algorithm working memory directly inside the FPGA fabric.
• I/O Density 850 I/O pins enable wide parallel interfaces, multi-channel connectivity, and flexible board-level interfacing options.
• Power Supply Core supply specified from 970 mV to 1.03 V to match board power design and regulator selection requirements.
• Package and Mounting 1760-BBGA (supplier device package 1761-FCBGA, 42.5 × 42.5 mm) in a surface-mount FCBGA format for high-density system assemblies.
• Operating Range and Grade Extended-grade device specified for operation from 0 °C to 100 °C, supporting designs with elevated ambient requirements within that range.
• Compliance RoHS compliant to support lead-free assembly processes and regulatory requirements.

Typical Applications

• Custom Hardware Acceleration Large logic capacity and significant embedded memory enable implementation of application-specific accelerators and parallel processing engines.
• High-Density I/O Systems 850 I/O pins make the device suitable for designs that require extensive external interfacing, multi-lane data capture, or large sensor arrays.
• Complex Digital Prototyping The combination of logic elements and on-chip RAM supports full-system prototyping and emulation of complex digital designs.

Unique Advantages

• Extensive Logic Resources: 582,720 logic elements provide headroom for large, multi-module FPGA designs without immediately needing an external ASIC.
• Substantial On-Chip Memory: Approximately 29.3 Mbits of embedded RAM reduces dependence on external memory for many buffering and local storage tasks.
• High I/O Count: 850 I/O pins simplify integration with multi-channel interfaces and parallel data paths, reducing external multiplexing or bridge logic.
• Compact FCBGA Packaging: 1760-BBGA (42.5 × 42.5 mm) package lets designers place a high-capacity FPGA in compact PCB layouts while supporting surface-mount assembly.
• Design-Ready Supply Range: 970 mV to 1.03 V supply specification allows precise power budgeting and regulator selection for board-level power design.
• Regulatory Compliance: RoHS compliance supports lead-free manufacturing and regulatory adherence.

Why Choose XC7V585T-3FFG1761E?

The XC7V585T-3FFG1761E positions itself as a high-capacity, reconfigurable solution for designs that require extensive programmable logic, ample embedded memory, and a large number of I/O signals within a compact FCBGA package. Its extended-grade specification and defined supply range help align system-level thermal and power planning for production deployments operating within 0 °C to 100 °C.

This device is well suited for engineering teams building complex accelerators, high-channel-count interfaces, or full-platform prototypes that benefit from significant on-chip resources and a single-package integration strategy. Its resource balance supports scalability and long-term design evolution within the Virtex®-7 T family context.

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