XC7V585T-2FFG1761I

The XC7V585T-2FFG1761I is a Virtex®-7 T field programmable gate array (FPGA) IC that provides a high count of programmable resources for complex digital designs. It integrates 582,720 logic elements, 45,525 CLBs and approximately 29.3 Mbits of embedded memory, with up to 850 I/O pins to support extensive interfacing needs.

Configured in a 1760-BBGA FCBGA package (supplier package: 1761-FCBGA (42.5x42.5)) and rated for industrial operation from -40°C to 100°C, this device is targeted at applications requiring substantial on-chip logic, memory and I/O capacity while meeting RoHS compliance.

Key Features

• Core Logic — 582,720 logic elements and 45,525 CLBs provide significant programmable fabric for implementing large, parallel and pipelined digital functions.
• Embedded Memory — Approximately 29.3 Mbits of on-chip RAM support buffering, FIFOs and local data storage without external memory for many functions.
• I/O Capacity — Up to 850 I/O pins enable high-density external connectivity for multi-channel interfaces, sensor arrays or parallel busses.
• Power Supply — Core voltage supply range from 970 mV to 1.03 V to align with system power design requirements.
• Package & Mounting — 1760-BBGA FCBGA package (supplier: 1761-FCBGA (42.5x42.5)) in a surface-mount form factor for board-level integration.
• Temperature & Grade — Industrial-grade device rated for operation from -40°C to 100°C to meet tougher environmental conditions.
• Environmental Compliance — RoHS compliant for regulatory and manufacturing compliance.

Typical Applications

• High-density logic implementations — For designs that require hundreds of thousands of logic elements and large programmable fabric to implement complex algorithms and state machines.
• On-chip buffering and data handling — Embedded memory of approximately 29.3 Mbits supports on-chip buffering, packet storage and local data processing without immediate dependency on external RAM.
• High-pin-count interfacing — Up to 850 I/O pins facilitate designs with extensive external connectivity or multi-channel I/O requirements.

Unique Advantages

• High logic density: 582,720 logic elements enable implementation of large-scale digital systems within a single FPGA package, reducing board-level complexity.
• Substantial embedded memory: Approximately 29.3 Mbits of on-chip RAM minimizes the need for external memory for many buffering and real-time processing tasks.
• Extensive I/O: Up to 850 I/O pins support broad interfacing options and simplify integration with multiple peripherals or parallel data channels.
• Industrial operating range: Rated from -40°C to 100°C to support applications that require wider temperature tolerance.
• RoHS compliant: Aligns with environmental and manufacturing requirements for reduced hazardous substances.
• Compact surface-mount package: 1760-BBGA FCBGA (supplier 1761-FCBGA (42.5x42.5)) provides a high-density mounting option for space-constrained boards.

Why Choose XC7V585T-2FFG1761I?

The XC7V585T-2FFG1761I positions itself for designs that demand a large programmable fabric, significant embedded memory and broad external connectivity in an industrial-grade FPGA. Its combination of 582,720 logic elements, approximately 29.3 Mbits of on-chip RAM and up to 850 I/O pins provides a platform for consolidating complex digital functions and reducing system-level component count.

This device is suited to engineers and procurement teams seeking a high-capacity Virtex®-7 T FPGA with defined voltage and temperature operating ranges, a compact FCBGA package, and RoHS compliance for environmentally conscious manufacturing. Its specification set supports scalable designs where logic density, memory and I/O count are primary selection criteria.

Request a quote or submit your procurement inquiry for the XC7V585T-2FFG1761I to receive pricing, availability and lead-time information.