XC7V585T-2FFG1157I

The XC7V585T-2FFG1157I is a Virtex-7 T Field Programmable Gate Array (FPGA) IC manufactured by AMD, supplied in a surface-mount FCBGA package (1156-BBGA / 1157-FCBGA). It targets designs that require large programmable logic capacity, significant on-chip memory, and a high number of I/O connections.

With approximately 582,720 logic elements, approximately 29.3 Mbits of embedded memory and up to 600 I/O pins, this device is specified for industrial environments and supports core supply voltages from 0.97 V to 1.03 V and an operating temperature range of -40 °C to 100 °C.

Key Features

• FPGA Architecture Virtex-7 T Field Programmable Gate Array offering large-scale programmable logic in a single device.
• Logic Capacity Approximately 582,720 logic elements to implement complex digital designs and custom logic functions.
• Embedded Memory Approximately 29.3 Mbits of on-chip RAM for buffering, data storage, and memory-intensive algorithms.
• I/O Density Up to 600 I/O pins to support wide or numerous external interfaces and parallel data paths.
• Power Supply Core voltage supply range of 0.97 V to 1.03 V to match required system power rails.
• Package and Mounting Surface-mount FCBGA packaging listed as 1156-BBGA, with supplier device package 1157-FCBGA (35×35) for compact, high-density board layouts.
• Industrial Temperature Grade Rated for operation from -40 °C to 100 °C, suitable for industrial temperature environments.
• Regulatory Compliance RoHS compliant for lead-free manufacturing requirements.

Typical Applications

• High-density signal processing — Implementation of large custom datapaths and parallel processing pipelines using abundant logic elements and on-chip RAM.
• Memory-intensive embedded systems — Buffering, packet processing, and algorithm acceleration that leverage approximately 29.3 Mbits of embedded memory.
• Multi-interface controllers — Designs requiring many external connections benefit from up to 600 I/O pins for parallel and mixed-signal interfacing.
• Industrial automation and control — Industrial-grade operating range and surface-mount FCBGA packaging support deployment in industrial equipment.

Unique Advantages

• Large programmable fabric: Approximately 582,720 logic elements enable implementation of complex, highly parallelized logic functions on a single device.
• Substantial on-chip memory: Approximately 29.3 Mbits of embedded RAM reduces dependency on external memory for many buffering and algorithmic tasks.
• High I/O count: Up to 600 I/O pins allow flexible connectivity and support for multiple high-bandwidth interfaces.
• Industrial temperature rating: Specified -40 °C to 100 °C operation for reliable use in industrial environments.
• Compact surface-mount package: 1156-BBGA / 1157-FCBGA (35×35) packaging enables high-density PCB implementations.
• RoHS compliance: Conforms to lead-free manufacturing requirements for regulatory and process compatibility.

Why Choose XC7V585T-2FFG1157I?

The XC7V585T-2FFG1157I combines very large logic capacity, significant embedded memory, and a high I/O count in an industrial-grade, surface-mount FCBGA package. This combination makes it well suited for complex programmable logic designs that require on-chip memory and extensive external connectivity while operating across a wide industrial temperature range.

As part of the Virtex-7 family from AMD, this device offers a platform-level option for engineers and procurement teams looking to consolidate system functionality into a single, high-density FPGA for industrial applications.

Request a quote or submit an inquiry to obtain pricing and availability for the XC7V585T-2FFG1157I.