XC7V585T-1FFG1761C

The XC7V585T-1FFG1761C is a Virtex®-7 T field programmable gate array (FPGA) IC delivered in a high-density FCBGA package. It provides a large logic capacity and substantial on-chip RAM to support complex programmable logic implementations, while offering a wide set of I/O and a defined core supply voltage range for system integration.

Key device parameters include approximately 582,720 logic elements, roughly 29.3 Mbits of embedded memory, 850 I/Os, a surface-mount FCBGA package, and a commercial operating temperature range of 0 °C to 85 °C.

Key Features

• FPGA Core  Virtex®-7 T field programmable gate array architecture provided in the XC7V585T-1FFG1761C part.
• Logic Capacity  Approximately 582,720 logic elements to implement large, highly-parallel programmable designs.
• Embedded Memory  Approximately 29.3 Mbits of total on-chip RAM, enabling substantial local storage for buffering and state retention.
• I/O Resources  850 general-purpose I/Os to support broad connectivity and multiple external interfaces.
• Power  Specified supply voltage range of 970 mV to 1.03 V for the device core.
• Package & Mounting  Surface-mount FCBGA in package case 1760-BBGA; supplier package listed as 1761-FCBGA with dimensions 42.5 × 42.5 mm.
• Operating Conditions & Grade  Commercial grade device with an operating temperature range from 0 °C to 85 °C.
• Environmental Compliance  RoHS-compliant construction.

Typical Applications

• High-density programmable logic systems  Use where large numbers of logic elements and on-chip RAM are needed to implement complex, customized digital functions.
• Multi-interface aggregation  Large I/O count supports designs that consolidate and route numerous external signals within a single FPGA package.
• On-chip memory–intensive functions  Embedded RAM capacity supports buffering, packet handling, and other tasks that benefit from sizeable local memory.

Unique Advantages

• Substantial logic density: Approximately 582,720 logic elements enable large-scale programmable designs without subdividing functionality across multiple devices.
• Significant embedded memory: Around 29.3 Mbits of on-chip RAM reduces dependence on external memory for many buffering and state-storage needs.
• High I/O count: 850 I/Os provide flexibility for systems that require many external connections or multiple simultaneous interfaces.
• Compact FCBGA packaging: Surface-mount 1760-BBGA / 1761-FCBGA (42.5 × 42.5 mm) helps integrate high capacity into space-constrained board layouts.
• Defined supply and thermal envelope: Core supply range of 970 mV–1.03 V and commercial temperature rating (0 °C–85 °C) allow predictable power budgeting and thermal planning.
• Regulatory conformity: RoHS compliance supports environmentally conscious product builds.

Why Choose XC7V585T-1FFG1761C?

The XC7V585T-1FFG1761C is positioned for designs that require high logic density, substantial on-chip memory, and a large number of I/Os in a single FCBGA package. Its defined supply voltage range and commercial temperature rating make it suitable for deployment in controlled thermal environments where those parameters match system requirements.

Choose this Virtex®-7 T FPGA when your project needs to consolidate complex programmable logic and memory-intensive functions into a single, RoHS-compliant device with a compact surface-mount package.

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