XC7V585T-1FFG1761I

The XC7V585T-1FFG1761I is an AMD Virtex®-7 T Field Programmable Gate Array (FPGA) in a 1760-BBGA FCBGA package, offered in an industrial grade. It provides high logic density, substantial on-chip memory, and large I/O capacity for demanding embedded and industrial designs.

With a wide operating temperature range and a defined core supply window, this device targets applications that require extensive programmable logic, embedded RAM, and robust I/O integration in a compact surface-mount package.

Key Features

• Core Logic  Approximately 582,720 logic elements provide a high-density programmable fabric for complex digital designs and custom hardware acceleration.
• Embedded Memory  Approximately 29.3 Mbits of on-chip RAM to support large buffers, FIFOs, and data processing functions without external memory dependencies.
• I/O Capacity  Up to 850 I/O pins to support extensive peripheral interfacing, multi-channel data aggregation, and high-pin-count system integration.
• Power Supply  Core voltage support from 0.970 V to 1.03 V, enabling defined power sequencing and design planning for the device core supply.
• Package & Mounting  Surface-mount FCBGA in a 1760-BBGA package; supplier device package listed as 1761-FCBGA (42.5×42.5 mm), providing a compact high-pin-count footprint.
• Operating Range & Compliance  Industrial-grade device with an operating temperature range of -40 °C to 100 °C and RoHS compliance for environmental and regulatory considerations.

Unique Advantages

• High logic integration: Approximately 582,720 logic elements help consolidate complex functions on-chip, reducing external components and board-level complexity.
• Large on-chip RAM: Approximately 29.3 Mbits of embedded memory supports substantial buffering and local data processing, lowering reliance on external memory.
• Extensive I/O: 850 I/O pins enable broad interfacing options for multi-protocol systems and high-channel-count designs.
• Industrial readiness: Specified for -40 °C to 100 °C operation and listed as industrial grade, making it suitable for deployment in temperature-challenging environments.
• Compact, high-pin-count package: The 1760-BBGA / 1761-FCBGA (42.5×42.5 mm) form factor provides a balance between pin density and board space for high-performance designs.
• Regulatory alignment: RoHS compliance supports environmental conformity for production and distribution.

Why Choose XC7V585T-1FFG1761I?

The XC7V585T-1FFG1761I delivers a combination of high logic element count, significant embedded memory, and large I/O capacity in an industrial-grade Virtex®-7 T FPGA package. Its defined core voltage range and wide operating temperature make it suitable for engineers specifying robust programmable solutions where on-chip resources and I/O scalability matter.

This device is suited for designs that require dense programmable logic, substantial internal RAM, and broad interfacing in a compact surface-mount FCBGA footprint—offering a pragmatic platform for complex industrial and embedded applications.

Request a quote or submit a procurement inquiry to evaluate XC7V585T-1FFG1761I for your next design project.