XC7V585T-1FF1761I

The XC7V585T-1FF1761I is a Virtex‑7 T family Field Programmable Gate Array (FPGA) IC from AMD, offering a high-density programmable logic fabric in a ball grid array package. It combines a large number of logic elements, substantial on‑chip RAM, and a high I/O count to address demanding, high‑density digital designs.

This device is targeted at applications that require significant logic capacity, plentiful embedded memory, and extensive external interfacing, while meeting industrial temperature and RoHS compliance requirements.

Key Features

• Logic Capacity  Approximately 582,720 logic elements to implement large, complex digital designs on a single device.
• Embedded Memory  Approximately 29.3 Mbits of on‑chip RAM for data buffering and on‑device storage.
• I/O Density  850 user I/O pins to support high channel counts and rich external connectivity.
• Power Supply  Core supply range of 0.97 V to 1.03 V for the device core power domain.
• Package & Mounting  1760‑BBGA, FCBGA package; supplier device package listed as 1761‑FCBGA with a 42.5 × 42.5 mm footprint. Surface mount design suitable for PCB assembly.
• Operating Range & Grade  Industrial grade device with an operating temperature range of −40 °C to 100 °C.
• Environmental Compliance  RoHS compliant.

Unique Advantages

• Large programmable fabric: The device’s nearly 582,720 logic elements enable consolidation of multiple functions into a single FPGA, reducing board-level component count.
• Substantial on‑chip memory: Approximately 29.3 Mbits of embedded RAM supports local buffering and state storage, minimizing reliance on external memory for many workloads.
• High I/O availability: 850 I/O pins provide flexibility for multi‑lane interfaces, parallel buses, and mixed signal routing across complex systems.
• Industrial readiness: Rated for −40 °C to 100 °C operation and listed as industrial grade, suitable for systems that require extended temperature performance.
• Surface‑mount BGA package: The 1760‑BBGA/1761‑FCBGA package supports compact PCB implementations while offering the pin density needed for high‑performance designs.
• RoHS compliant: Conforms to RoHS requirements for environmentally conscious manufacturing and deployment.

Why Choose XC7V585T-1FF1761I?

The XC7V585T-1FF1761I positions itself as a high‑density programmable solution that brings together a large logic fabric, significant embedded memory, and abundant I/O in a single industrial‑grade package. These attributes make it well suited for designers who need to integrate complex logic functions and substantial on‑chip data storage while maintaining robust environmental operating margins.

Manufactured by AMD and offered in a compact surface‑mount FCBGA package, this device provides a scalable hardware building block for advanced digital systems where consolidation, I/O flexibility, and industrial temperature range are important considerations.

Request a quote or submit an inquiry to receive pricing and availability for the XC7V585T-1FF1761I. Provide your quantity and delivery requirements to get a tailored response.