XC7V2000T-L2FHG1761E

The XC7V2000T-L2FHG1761E is a high-density Virtex®-7 T field-programmable gate array (FPGA) in a 1760-BBGA FCBGA package. It delivers large on-chip resources—over 1.95 million logic elements and approximately 47.6 Mbits of embedded memory—paired with extensive I/O capability for complex, reconfigurable digital designs.

Designed for extended-grade operation, this device supports demanding hardware designs that require significant logic capacity, high memory density, and many external interfaces while operating within a 0 °C to 100 °C range and a core supply window of 0.97 V to 1.03 V.

Key Features

• Logic Capacity  Provides 1,954,560 logic elements to implement large-scale, fine-grained digital logic and custom processing pipelines.
• Embedded Memory  Includes approximately 47.6 Mbits of on-chip RAM to support buffering, lookup tables, and local data storage for complex algorithms.
• I/O and Packaging  Offers 850 user I/O pins and a 1760-BBGA (FCBGA) package; supplier device package listed as 1761-FCBGA (45×45), suitable for compact, high-pin-count board designs.
• Power and Voltage  Core voltage supply range of 0.97 V to 1.03 V enables integration into regulated power domains and predictable power budgeting.
• Operational Grade & Temperature  Extended-grade device rated for operation from 0 °C to 100 °C for deployments requiring above-commercial-temperature stability.
• Mounting & Compliance  Surface-mount package with RoHS compliance for modern assembly processes and regulatory requirements.

Typical Applications

• Complex digital systems  For designs that require very large logic capacity and embedded memory to implement custom datapaths and parallel processing.
• High‑I/O interface engines  Suitable where many external signals must be managed concurrently, using the device’s 850 I/O pins.
• On‑chip buffering and lookup-intensive tasks  Applications that rely on substantial on-chip RAM for data staging, LUTs, and state storage.

Unique Advantages

• High-density logic resources: 1,954,560 logic elements enable consolidation of large designs into a single FPGA, reducing board-level complexity.
• Significant on-chip memory: Approximately 47.6 Mbits of embedded RAM minimizes external memory requirements and improves data locality.
• Extensive I/O capability: 850 user I/Os provide flexibility for interfacing multiple peripherals and high-pin-count systems.
• Compact, high-pin-count package: The 1760-BBGA / 1761-FCBGA (45×45) packaging balances board area with high connectivity for dense system designs.
• Extended-grade operation: Rated for 0 °C to 100 °C to support applications needing wider-than-standard commercial temperature range.
• RoHS compliant: Meets environmental compliance expectations for modern electronics manufacturing.

Why Choose XC7V2000T-L2FHG1761E?

The XC7V2000T-L2FHG1761E positions itself as a high-capacity, reconfigurable platform for engineers who need substantial logic, memory, and I/O in a single FPGA. With nearly two million logic elements, tens of megabits of embedded RAM, and 850 I/Os, it supports consolidation of large and complex digital functions while simplifying board-level design.

Its extended-grade rating, surface-mount FCBGA packaging, and defined core voltage range make it suitable for robust system designs where predictable electrical and thermal behavior are important. This FPGA is well suited to teams developing large-scale programmable logic solutions that require long-term scalability and integration into compact, high-pin-count assemblies.

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