XC7V2000T-1FLG1925C

The XC7V2000T-1FLG1925C is a Virtex®-7 T series FPGA from AMD offering very high logic density and large on-chip memory for complex, configurable digital designs. It provides approximately 1,954,560 logic elements, roughly 47.6 Mbits of embedded memory, and up to 1,200 I/O connections in a BGA/FCBGA package, making it suitable for commercial applications that require substantial logic capacity and I/O bandwidth.

Supplied in surface-mount BGA/FCBGA package options and rated for commercial temperature operation, this device targets designs where integration density, a high number of I/Os, and sizable embedded RAM are key system drivers.

Key Features

• Core logic capacity  Approximately 1,954,560 logic elements to implement large-scale programmable logic and complex custom architectures.
• Embedded memory  Approximately 47.6 Mbits of on-chip RAM (total RAM bits: 47,628,288) for buffering, large data structures, and memory-intensive functions.
• I/O resources  Up to 1,200 I/O pins to support extensive connectivity and multi‑channel interfacing requirements.
• Power supply  Core supply range of 970 mV to 1.03 V, enabling defined power planning for core rails in system designs.
• Package and mounting  Offered in 1924-BBGA, FCBGA package formats; supplier device package indicated as 1925-FCBGA (45×45). Surface-mount mounting type simplifies board assembly for modern PCBs.
• Operating range and grade  Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Environmental compliance  RoHS compliant for adherence to common environmental and manufacturing requirements.

Typical Applications

• Custom high-density logic implementations  Use the large logic element count to realize complex state machines, datapaths, and algorithmic accelerators within a single FPGA.
• On-chip data buffering and memory‑intensive functions  Leverage approximately 47.6 Mbits of embedded RAM for buffering, large lookup tables, and data staging in streaming applications.
• High‑I/O interface integration  Deploy up to 1,200 I/Os to connect numerous peripherals, transceivers, and multichannel interfaces on dense system boards.

Unique Advantages

• Very high integration density: The large logic element count enables consolidation of multiple functions into a single device, reducing system component count.
• Significant embedded memory: Approximately 47.6 Mbits of on-chip RAM supports memory-heavy designs without immediate need for external memory.
• Extensive I/O capability: Up to 1,200 I/Os provide flexibility for complex interconnect and interface requirements across a variety of signals.
• Defined power domain: Narrow core voltage range (970 mV–1.03 V) assists in precise power-supply design and thermal budgeting.
• Surface-mount BGA/FCBGA packaging: Industry-standard package options simplify integration into high-density PCB layouts.
• Commercial temperature and RoHS compliance: Suited for mainstream commercial applications with environmental compliance for manufacturing.

Why Choose XC7V2000T-1FLG1925C?

The XC7V2000T-1FLG1925C positions itself as a high-density, highly integrated FPGA option for commercial designs that demand substantial logic resources, large embedded memory, and broad I/O connectivity. Its combination of nearly two million logic elements, roughly 47.6 Mbits of on-chip RAM, and up to 1,200 I/Os enables consolidation of complex system functions and supports designs that require extensive programmable logic and memory capacity.

This device is appropriate for engineering teams and procurement sourcing FPGA solutions for advanced commercial applications where integration, scalability, and adherence to RoHS are important. Its surface-mount BGA/FCBGA packaging and defined operating and power ranges facilitate predictable system integration and long-term design planning.

If you would like pricing, availability, or to request a quote for the XC7V2000T-1FLG1925C, please submit a quote request or contact the sales channel for assistance.