XC7V2000T-2FLG1925C

The XC7V2000T-2FLG1925C is an AMD Virtex‑7 T family field programmable gate array supplied in a FCBGA package. It integrates a very large logic fabric with extensive on-chip memory and high I/O density for complex, compute‑intensive designs.

This device is offered in a surface‑mount 1924‑BBGA / 1925‑FCBGA (45×45) package, operates on a core supply between 0.970 V and 1.03 V, and is rated for commercial temperature operation from 0 °C to 85 °C. It is RoHS compliant.

Key Features

• Core Logic  Contains 1,954,560 logic elements and 152,700 CLBs to implement large-scale digital designs.
• Embedded Memory  Approximately 47.6 Mbits of on‑chip RAM for buffering, lookup tables, and state storage.
• I/O Density  Provides 1,200 I/O pins to support a wide variety of external interfaces and high‑throughput connectivity.
• Power  Core voltage supply range specified from 0.970 V to 1.03 V for the device core rails.
• Package & Mounting  Available in 1924‑BBGA, FCBGA packaging with supplier device package listed as 1925‑FCBGA (45×45); intended for surface‑mount assembly.
• Operating Conditions  Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant.

Unique Advantages

• High logic capacity: Enables implementation of large, complex FPGA designs with 1,954,560 logic elements and 152,700 CLBs.
• Substantial on‑chip memory: Roughly 47.6 Mbits of embedded RAM reduces external memory dependency for many applications.
• Extensive I/O resources: 1,200 I/Os support dense interfacing requirements and multiple parallel channels.
• Compact FCBGA package: 1924‑BBGA / 1925‑FCBGA (45×45) packaging provides a high pin‑count solution in a surface‑mount form factor.
• Commercial temperature rating: Suited to systems and products designed for standard commercial environments (0 °C to 85 °C).
• Regulatory friendliness: RoHS compliance supports environmental and manufacturing requirements.

Why Choose XC7V2000T-2FLG1925C?

The XC7V2000T-2FLG1925C positions itself as a high‑capacity FPGA option for designs that require large logic fabrics, significant on‑chip memory, and dense I/O. Its combination of nearly two million logic elements, substantial embedded RAM, and 1,200 I/Os makes it suitable for demanding compute and integration tasks where consolidation of logic and memory on a single device is advantageous.

Manufactured by AMD and supplied in a high‑pin‑count FCBGA package with surface‑mount mounting, the device offers a scalable platform for complex digital systems developed for commercial operating environments. Its power and temperature specifications provide clear design parameters for system integrators and procurement decisions.

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