XC7V585T-1FFG1157C

The XC7V585T-1FFG1157C is a Virtex®-7 T Field Programmable Gate Array (FPGA) from AMD, designed to deliver a high-capacity programmable fabric for complex digital designs. With 582,720 logic elements, approximately 29.3 Mbits of embedded memory, and 600 I/O pins, it targets applications that require large logic density, substantial on-chip memory, and extensive external connectivity.

Key Features

• Logic Capacity 582,720 logic elements provide significant programmable fabric for implementing large-scale digital logic and complex algorithms.
• Embedded Memory Approximately 29.3 Mbits of on-chip RAM to support buffer, state, and data storage needs within the FPGA fabric.
• I/O 600 user I/O pins to enable broad external interfacing and high-pin-count system integration.
• Package & Mounting Surface-mount FCBGA package (1156-BBGA, FCBGA) with supplier device package listed as 1157-FCBGA (35×35) for dense board-level integration.
• Power Core voltage supply range of 0.970 V to 1.03 V for the device core domain.
• Operating Range & Grade Commercial operating temperature range of 0 °C to 85 °C; specified as Commercial grade.
• Environmental Compliance RoHS compliant.

Typical Applications

• High‑density digital processing — Implement large, logic‑intensive functions that benefit from the device's 582,720 logic elements and extensive programmable fabric.
• Memory‑centric designs — Use on-chip RAM (approximately 29.3 Mbits) for buffering, lookup tables, and state storage without relying solely on external memory.
• Systems requiring broad I/O — Leverage 600 user I/O pins to connect to multiple peripherals, sensors, or high-pin-count daughter cards.
• Compact, board‑level integration — Surface-mount FCBGA package and 35×35 supplier package dimensions support dense PCB layouts where space and pin count are critical.

Unique Advantages

• Large programmable fabric: 582,720 logic elements enable consolidation of multiple functions into a single device, reducing system component count.
• Substantial on‑chip memory: Approximately 29.3 Mbits of embedded RAM reduces dependency on external memory for many use cases, improving latency and simplifying routing.
• High I/O count: 600 I/O pins provide flexibility for interfacing to a wide range of peripherals and high-pin-count systems.
• Compact package footprint: FCBGA mounting and 35×35 supplier package allow high-density board designs while maintaining robust mounting for production assemblies.
• Commercial temperature suitability: Rated for 0 °C to 85 °C operation, matching many commercial and enterprise system requirements.
• Environmental compliance: RoHS compliance supports regulatory requirements for many global electronics programs.

Why Choose XC7V585T-1FFG1157C?

The XC7V585T-1FFG1157C positions itself as a high-capacity Virtex®-7 T FPGA option for engineers who need substantial logic resources, significant on-chip RAM, and a large number of I/O in a surface-mount FCBGA package. Its combination of 582,720 logic elements, approximately 29.3 Mbits of embedded memory, and 600 I/O pins makes it well-suited to consolidate complex digital functions on a single device while supporting dense PCB integration.

Manufactured by AMD and offered in a commercial temperature grade with RoHS compliance, the XC7V585T-1FFG1157C provides a scalable hardware building block for designs that require high logic density and extensive connectivity. Use this device where on‑chip memory, wide I/O, and a compact package are central to system design goals.

Request a quote or submit a purchase inquiry today to obtain pricing and availability for the XC7V585T-1FFG1157C.