XC7S75-L1FGGA484I

The XC7S75-L1FGGA484I is a Spartan®-7 Field Programmable Gate Array (FPGA) IC designed for industrial-grade embedded systems. It provides a balance of logic density, on-chip memory, and I/O capacity in a compact 484-ball FPBGA package for surface-mount assembly.

With 76,800 logic elements, approximately 4.33 Mbits of embedded memory, and 338 user I/O pins, this device is suited to designs that require significant programmable logic, ample local RAM, and broad external connectivity while meeting industrial temperature and RoHS requirements.

Key Features

• Core / Logic  76,800 logic elements provide substantial programmable logic resources for custom processing, state machines, and glue-logic implementations.
• Embedded Memory  Approximately 4.33 Mbits of on-chip RAM supports buffering, FIFO storage, and intermediate data processing without external memory.
• I/O Density  338 user I/O pins enable high connectivity to sensors, interfaces, and external peripherals for complex systems integration.
• Power  Operates from a supply range of 920 mV to 980 mV, allowing integration into designs with tight core-voltage requirements.
• Package & Mounting  484-FPBGA (23×23) package in a surface-mount form factor offers a compact footprint for space-constrained PCBs.
• Temperature & Grade  Industrial-grade operation from −40°C to 100°C supports deployment in a wide range of environmental conditions.
• Environmental Compliance  RoHS-compliant construction aligns with regulatory and sustainability requirements.

Typical Applications

• Industrial Control  Programmable logic and I/O count make this FPGA suitable for motor control, PLC extensions, and machine automation functions requiring robust operation across −40°C to 100°C.
• Embedded Processing  Ample logic elements and on-chip RAM support custom datapath implementations, protocol handling, and hardware accelerators in embedded systems.
• Data Acquisition & Instrumentation  High I/O density and local memory allow aggregation, preprocessing, and buffering of sensor and measurement data at the board level.
• Communication Interfaces  Multiple I/O combined with programmable logic enable interface bridging, protocol conversion, and timing adaptations for complex connectivity needs.

Unique Advantages

• High Logic Capacity: 76,800 logic elements deliver the resources needed for sizable custom logic functions without immediate need for larger devices.
• Significant On-Chip Memory: Approximately 4.33 Mbits of embedded RAM reduces dependence on external memory for buffering and temporary storage.
• Extensive Connectivity: 338 user I/Os provide flexibility for multi-interface designs and dense peripheral integration.
• Industrial Temperature Range: Rated from −40°C to 100°C to support deployment in demanding environments.
• Compact Surface-Mount Packaging: 484-FPBGA (23×23) package enables space-efficient board layouts while maintaining high pin count.
• RoHS Compliant: Environmentally compliant construction assists with regulatory and manufacturing requirements.

Why Choose XC7S75-L1FGGA484I?

The XC7S75-L1FGGA484I positions itself as a capable industrial-grade FPGA offering a combination of substantial logic resources, embedded memory, and high I/O density in a compact 484-BGA package. These attributes make it suitable for engineers designing robust embedded systems, industrial controls, and interface-rich applications that require programmability and reliable operation across a wide temperature range.

Manufactured by AMD and delivered in a surface-mount FPBGA form factor, this device provides a practical balance of integration and board-level flexibility for projects that demand on-chip processing, buffering, and extensive external connectivity. Its RoHS compliance and specified voltage and temperature ranges help simplify system-level qualification and deployment planning.

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