XC7S75-2FGGA676I

The XC7S75-2FGGA676I is a Spartan®-7 field programmable gate array (FPGA) from AMD packaged in a 676-ball BGA. It provides a balance of programmable logic capacity, on-chip memory and I/O density for designs requiring substantial embedded logic and connectivity within an industrial-grade device.

With 76,800 logic elements and approximately 4.33 Mbits of embedded memory, the device targets applications where dense logic implementation, significant on-chip RAM and up to 400 I/O pins are required, while supporting a core supply range of 0.95 V to 1.05 V and industrial operating temperatures.

Key Features

• Logic Capacity — 76,800 logic elements provide a large programmable fabric for implementing complex custom logic and state machines.
• Embedded Memory — Approximately 4.33 Mbits of on-chip RAM to support buffering, lookup tables and local data storage without external memory.
• I/O Density — Up to 400 I/O pins to support wide bus interfaces, multiple peripherals or parallel signaling requirements.
• Power Supply — Core voltage supply range of 0.95 V to 1.05 V for the FPGA core rails.
• Package & Mounting — 676-BGA package (supplier device package: 676-FPBGA, 27×27) in a surface-mount form factor for compact, high-pin-count board designs.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C, suitable for industrial temperature environments.
• Regulatory Compliance — RoHS compliant, meeting common lead-free manufacturing requirements.

Typical Applications

• I/O-Intensive Systems — Designs requiring up to 400 configurable I/O signals can use this device to consolidate multiple interfaces on a single FPGA.
• Embedded Logic and On-Chip Memory — With approximately 4.33 Mbits of embedded RAM and 76,800 logic elements, the device supports local buffering, data processing and control logic.
• Industrial Control — Industrial-grade operation and a −40 °C to 100 °C range suit control systems and automation hardware that require robust temperature tolerance.

Unique Advantages

• Substantial Logic Resource: 76,800 logic elements enable complex custom logic implementations without external programmable devices.
• On-Chip Memory Capacity: Approximately 4.33 Mbits of embedded RAM reduce dependence on external memory for many buffering and lookup functions.
• High I/O Count: 400 I/O pins deliver flexible connectivity for multi-interface systems and wide parallel buses.
• Industry-Grade Thermal Range: Rated from −40 °C to 100 °C to address temperature-challenging deployments.
• Compact, High-Pin Package: 676-BGA (27×27 FPBGA) supports high interconnect density in a surface-mount footprint.
• Tight Core Voltage Window: 0.95 V to 1.05 V core supply compatibility for designs specifying defined core rails.

Why Choose XC7S75-2FGGA676I?

The XC7S75-2FGGA676I combines a large pool of programmable logic, significant embedded RAM and a high I/O count within a compact 676-BGA package rated for industrial temperatures. This configuration is suited to system designs that need integrated, on-chip resources and robust thermal tolerance without resorting to multiple discrete components.

Engineers and procurement teams looking for an FPGA that aligns logic capacity, memory and connectivity with surface-mount packaging and RoHS compliance will find the XC7S75-2FGGA676I a practical choice for scalable, reliable designs.

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