XC7S75-1FGGA676Q

The XC7S75-1FGGA676Q is a Spartan®-7 Field Programmable Gate Array (FPGA) IC from AMD supplied in a 676‑ball BGA package. It delivers a balanced combination of logic capacity, embedded memory, and I/O density in an AEC‑Q100 qualified device for automotive applications.

Key device attributes include approximately 76,800 logic elements, approximately 4.33 Mbits of embedded memory, 400 I/O pins, a supply range of 0.95 V to 1.05 V, and an operating temperature range of −40 °C to 125 °C.

Key Features

• Logic Capacity  Approximately 76,800 logic elements to implement complex digital functions and custom logic.
• Embedded Memory  Approximately 4.33 Mbits of on‑chip RAM for buffering, lookup tables, and state storage.
• I/O Density  400 I/O pins to support multiple interfaces and high‑pin‑count systems.
• Power  Core supply range of 0.95 V to 1.05 V for defined operating conditions.
• Package and Mounting  676‑BGA package (676‑FPBGA, 27×27) designed for surface‑mount assembly.
• Automotive Qualification  AEC‑Q100 qualification and an operating temperature range of −40 °C to 125 °C for automotive electronics use.
• Environmental Compliance  RoHS compliant for regulatory and manufacturing considerations.

Typical Applications

• Automotive Electronic Modules  Suitable for electronic modules that require AEC‑Q100 qualified programmable logic and extended temperature operation.
• High‑I/O Embedded Systems  Used where high pin count is needed to interface multiple sensors, actuators, or peripherals via 400 available I/Os.
• Compact Surface‑Mount Designs  Ideal for designs that require a 676‑ball BGA surface‑mount package with substantial logic and memory resources.

Unique Advantages

• Automotive‑grade Qualification: AEC‑Q100 qualification and −40 °C to 125 °C operation support deployment in automotive environments.
• Substantial Logic Integration: Approximately 76,800 logic elements enable integration of custom functions and system-level logic without external components.
• On‑chip Memory Capacity: Approximately 4.33 Mbits of embedded RAM reduces dependence on external memory for many control and buffering tasks.
• High I/O Count: 400 I/O pins provide flexibility for complex interfacing and multiple parallel connections.
• Industry‑standard Packaging: 676‑BGA (676‑FPBGA, 27×27) surface‑mount package simplifies placement in compact PCBs.
• Regulatory Compliance: RoHS compliance supports environmentally conscious manufacturing workflows.

Why Choose XC7S75-1FGGA676Q?

The XC7S75-1FGGA676Q positions itself as a capable Spartan‑7 FPGA option where automotive qualification, significant logic and memory resources, and high I/O density are required. Its AEC‑Q100 qualification and wide operating temperature range make it suitable for automotive electronics and other applications that demand extended environmental capability.

Designers seeking a surface‑mount FPGA in a 676‑BGA footprint with approximately 76,800 logic elements, around 4.33 Mbits of embedded RAM, and 400 I/Os will find this device aligned with applications that require integrated programmable logic and reliable operation across temperature extremes.

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