XC7S75-1FGGA676C

IC FPGA 400 I/O 676FPBGA
Part Description

Spartan®-7 Field Programmable Gate Array (FPGA) IC 400 4331520 76800 676-BGA

Quantity 157 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package676-FPBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case676-BGANumber of I/O400Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs6000Number of Logic Elements/Cells76800
Number of GatesN/AECCN5A002A1HTS Code8542.39.0001
QualificationN/ATotal RAM Bits4331520

Overview of XC7S75-1FGGA676C – Spartan®-7 FPGA, 676-BGA

The XC7S75-1FGGA676C is a Spartan®-7 Field Programmable Gate Array (FPGA) IC from AMD. It provides a balanced set of logic, memory, and I/O resources in a compact 676-ball BGA package for commercial-grade designs.

Key on-chip resources include 76,800 logic elements and approximately 4.33 Mbits of embedded memory, supported by 400 I/O pins. The device is specified for surface-mount use, operates from a core supply of 950 mV to 1.05 V, and is rated for 0 °C to 85 °C operating temperature.

Key Features

  • Logic Resources — 76,800 logic elements provide substantial programmable logic capacity for mid-range digital designs.
  • Embedded Memory — Approximately 4.33 Mbits of on-chip RAM for buffering, state storage, and data processing.
  • I/O Count — 400 I/O pins to interface with external peripherals, sensors, and system buses.
  • Power — Core voltage supply specified from 950 mV to 1.05 V for the device core.
  • Package and Mounting — 676-BGA (supplier package: 676-FPBGA, 27 × 27 mm) designed for surface-mount assembly.
  • Operating Range — Commercial-grade device rated for 0 °C to 85 °C ambient operation.
  • Environmental Compliance — RoHS compliant.

Unique Advantages

  • Substantial programmable logic capacity: 76,800 logic elements allow complex logic implementations without external programmable logic devices.
  • Integrated on-chip memory: Approximately 4.33 Mbits of embedded RAM reduces the need for external memory in many designs.
  • High I/O availability: 400 I/O pins support multiple peripheral interfaces and parallel connectivity.
  • Compact BGA footprint: 676-ball FPBGA (27 × 27 mm) package enables dense board integration in space-constrained applications.
  • Tight core voltage specification: A defined core supply range of 950 mV to 1.05 V supports controlled power delivery designs.
  • Commercial temperature rating: Specified for 0 °C to 85 °C operation, matching typical commercial embedded applications.

Why Choose XC7S75-1FGGA676C?

The XC7S75-1FGGA676C combines a sizable logic fabric, meaningful embedded memory, and a high I/O count in a compact 676-BGA package, making it well suited for commercial embedded and digital designs that require balanced integration of logic, memory, and interfaces. Its defined core voltage range and RoHS compliance make it straightforward to incorporate into controlled-power, surface-mount PCB assemblies.

For designers seeking a commercially graded Spartan®-7 FPGA with clear, verifiable on-chip resources—76,800 logic elements, approximately 4.33 Mbits of RAM, and 400 I/Os—this device offers a practical combination of capacity and packaging for mid-range programmable designs.

Request a quote or submit a pricing inquiry for the XC7S75-1FGGA676C to check availability and lead time for your next project.

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