XC7S75-1FGGA484C

The XC7S75-1FGGA484C is a Spartan®-7 field programmable gate array (FPGA) from AMD designed for commercial-grade, surface-mount applications. It delivers substantial programmable logic and on-chip memory capacity along with up to 338 general-purpose I/O pins, supporting designs that require dense logic, embedded memory, and flexible I/O integration.

Key electrical and environmental parameters include a core supply range of 950 mV to 1.05 V and an operating temperature range of 0 °C to 85 °C. The device is offered in a 484-ball BGA package (484-FPBGA, 23 × 23) and is RoHS compliant.

Key Features

• Logic Capacity — 76,800 logic elements supporting complex combinational and sequential logic structures.
• Configurable Logic Blocks (CLBs) — 6,000 CLBs providing the fabric for user-defined logic implementation.
• Embedded Memory — Approximately 4.33 Mbits of on-chip RAM to support data buffering, FIFOs, and small lookup tables.
• I/O Density — 338 I/O pins for high-density interfacing to peripherals, buses, and external devices.
• Power — Core voltage supply range: 0.95 V to 1.05 V to match targeted power domains.
• Package and Mounting — 484-BGA (supplier package: 484-FPBGA 23×23) in a surface-mount format suitable for modern PCB assembly.
• Temperature and Grade — Commercial grade operation from 0 °C to 85 °C for standard embedded and industrial-adjacent applications.
• Regulatory — RoHS compliant.

Typical Applications

• Custom Logic and Prototyping — Implement application-specific accelerators and control logic leveraging 76,800 logic elements and abundant CLBs.
• High-Density I/O Interfaces — Bridge multiple peripherals and buses with 338 available I/Os for system integration and board-level consolidation.
• On-Chip Data Handling — Use approximately 4.33 Mbits of embedded memory for buffering, packet handling, and small data stores.
• Embedded System Control — Deploy in commercial embedded designs that require programmable logic, moderate temperature range, and surface-mount packaging.

Unique Advantages

• Substantial Logic Resources: 76,800 logic elements enable implementation of sizable custom logic blocks and state machines without external discrete logic.
• Integrated Memory: Approximately 4.33 Mbits of on-chip RAM reduces reliance on external memory for many buffering and temporary storage needs.
• High I/O Count: 338 I/Os provide flexibility for multi-channel interfaces, sensor arrays, and peripheral-rich designs.
• Compact BGA Package: 484-ball BGA (23 × 23) balances pin count and PCB footprint for dense board layouts.
• Commercial Temperature Rating: Specified 0 °C to 85 °C operation for mainstream embedded applications.
• RoHS Compliance: Conforms to RoHS requirements for environmentally conscious manufacturing and assembly.

Why Choose XC7S75-1FGGA484C?

The XC7S75-1FGGA484C positions itself as a capable Spartan®-7 FPGA option for designers needing a mix of high logic capacity, embedded memory, and a large number of I/Os in a compact BGA package. Its combination of 76,800 logic elements, approximately 4.33 Mbits of on-chip RAM, and 338 I/Os supports a wide range of commercial embedded system requirements where programmable hardware and I/O density matter.

Engineers and procurement teams selecting this device gain a commercially rated, RoHS-compliant FPGA in a surface-mount 484-BGA package with clearly defined supply and temperature ranges, making it suitable for scalable, board-level integration in many programmable-logic projects.

Request a quote or submit an inquiry to obtain pricing and availability for the XC7S75-1FGGA484C.