XC7S6-L1CPGA196I
| Part Description |
Spartan®-7 Field Programmable Gate Array (FPGA) IC 100 184320 6000 196-TFBGA, CSBGA |
|---|---|
| Quantity | 735 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 196-CSPBGA (8x8) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 196-TFBGA, CSBGA | Number of I/O | 100 | Voltage | 920 mV - 980 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 469 | Number of Logic Elements/Cells | 6000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 184320 |
Overview of XC7S6-L1CPGA196I – Spartan®-7 FPGA, 6,000 Logic Elements, 184,320-bit RAM, 100 I/Os, 196-TFBGA
The XC7S6-L1CPGA196I is a Spartan®-7 field programmable gate array (FPGA) from AMD supplied in a 196-TFBGA/CSBGA package. It provides mid-range programmable logic capacity with on-chip RAM and a 100-pin I/O count, targeted for industrial applications where configurable logic, compact packaging, and defined operating ranges are required.
Key Features
- Logic Capacity Approximately 6,000 logic elements across 469 CLBs to implement custom logic, control paths, and glue-logic functions.
- Embedded Memory About 184,320 bits of on-chip RAM (approximately 0.18 Mbits) for buffering, small FIFOs, and local data storage.
- I/O Density 100 user I/O pins suitable for connecting to peripherals, sensors, and external devices.
- Power Supply Operates from a core voltage range of 920 mV to 980 mV, enabling designs targeting low-voltage FPGA cores.
- Package & Mounting Delivered in a 196-TFBGA, CSBGA package (supplier device package: 196-CSPBGA (8×8)) and intended for surface-mount assembly.
- Temperature & Grade Industrial-grade device with an operating temperature range of −40 °C to 100 °C for deployment in temperature-variable environments.
- Environmental Compliance RoHS compliant, meeting common lead-free requirements for electronic assemblies.
Typical Applications
- Industrial Control Programmable logic for control and sequencing functions in industrial equipment, leveraging the industrial temperature rating.
- Embedded System Glue Logic Custom bus interfacing and protocol adaptation using the FPGA’s logic capacity and 100 I/Os to connect heterogeneous subsystems.
- Low-Voltage Designs Applications that require a low core voltage operating range (920 mV–980 mV) while maintaining programmable logic flexibility.
Unique Advantages
- Balanced Logic and Memory A combination of approximately 6,000 logic elements and ~0.18 Mbits of embedded RAM enables compact, self-contained FPGA implementations.
- Industrial Temperature Range Rated from −40 °C to 100 °C for reliable operation across demanding ambient conditions.
- Compact BGA Packaging 196-TFBGA/CSBGA package (196-CSPBGA, 8×8) provides a small PCB footprint for space-constrained designs.
- Ample I/O 100 user I/Os offer flexibility to interface with sensors, actuators, and external components without external multiplexing in many designs.
- Low-Voltage Core Operation Core supply range of 920 mV–980 mV supports designs targeting low-power FPGA core rails.
- Regulatory Compliance RoHS compliance simplifies selection for lead-free manufacturing processes.
Why Choose XC7S6-L1CPGA196I?
The XC7S6-L1CPGA196I positions itself as a practical mid-range Spartan®-7 FPGA for industrial applications requiring a compact BGA footprint, a clear operating-temperature specification, and a defined set of resources: roughly 6,000 logic elements, about 184,320 bits of on-chip RAM, and 100 I/Os. Its low core voltage range and RoHS compliance make it suitable for designs prioritizing low-voltage operation and lead-free assembly.
Manufactured by AMD and supplied in a 196-TFBGA package for surface-mount assembly, this device is appropriate for customers building industrial controllers, embedded interfacing modules, or other equipment that benefits from reprogrammable logic, defined environmental ratings, and a compact package profile.
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