XC7S75-2FGGA484I

The XC7S75-2FGGA484I is a Spartan®-7 field programmable gate array (FPGA) IC provided in a 484-ball BGA package. It integrates a substantial logic fabric with abundant on-chip memory and a large number of I/O pins, and is supplied in an industrial-grade device specification.

This device targets designs that require a balance of logic density, embedded memory, and a high I/O count while operating across an industrial temperature range and standard FPGA core voltage window.

Key Features

• Core Logic 76,800 logic elements provide a sizable programmable fabric for custom digital functions and glue logic.
• Embedded Memory Approximately 4.3 Mbits of on-chip RAM for data buffering, state storage, and local memory needs.
• I/O Capacity 338 user I/O pins support dense external connectivity for sensors, interfaces, and peripheral devices.
• Packaging & Mounting 484-ball BGA package (supplier package: 484-FPBGA, 23×23) with surface-mount mounting for compact board-level integration.
• Power Requirements Core supply voltage range from 0.95 V to 1.05 V to match system power rails and regulator designs.
• Operating Temperature Rated for industrial operation from −40 °C to 100 °C.
• Environmental Compliance RoHS compliant for conformity with common environmental requirements.

Typical Applications

• Industrial Control Systems Use the FPGA’s logic density and industrial-temperature rating for programmable control, interface bridging, and custom signal processing in factory and machine automation.
• Embedded Processing and Glue Logic Implement custom datapaths, protocol conversion, and peripheral aggregation where on-chip memory and numerous I/Os simplify system design.
• High-Density I/O Interfaces Leverage 338 I/O pins for boards requiring many external connections such as sensor arrays, communication front-ends, or mixed-signal interfaces.

Unique Advantages

• Substantial Logic Capacity: 76,800 logic elements enable complex custom logic implementations without immediate need to move to larger device families.
• Significant On-Chip Memory: Approximately 4.3 Mbits of embedded RAM reduce dependence on external memory for buffering and state retention.
• High I/O Count: 338 I/Os permit versatile board-level connections and flexible interface routing options.
• Industrial Temperature Rating: Specified −40 °C to 100 °C operation supports deployment in harsher environmental conditions.
• Compact BGA Packaging: 484-FPBGA (23×23) surface-mount package allows dense system integration while maintaining signal routing capability.
• RoHS Compliance: Meets environmental substance restrictions commonly required in procurement and manufacturing.

Why Choose XC7S75-2FGGA484I?

The XC7S75-2FGGA484I provides a balanced combination of logic density, embedded memory, and extensive I/O in a compact 484-BGA package rated for industrial temperatures. It is suitable for designs that require programmable logic with ample on-chip RAM and a large number of external interfaces while operating within a 0.95–1.05 V core supply window.

This device is well suited for engineers and procurement teams seeking a reliable, RoHS-compliant Spartan®-7 FPGA solution that supports mid-density logic integration and robust connectivity for industrial and embedded applications.

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