XCS05-3VQ100I

IC FPGA 77 I/O 100VQFP
Part Description

Spartan® Field Programmable Gate Array (FPGA) IC 77 3200 238 100-TQFP

Quantity 1,036 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package100-VQFP (14x14)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case100-TQFPNumber of I/O77Voltage4.5 V - 5.5 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs100Number of Logic Elements/Cells238
Number of Gates5000ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits3200

Overview of XCS05-3VQ100I – Spartan® Field Programmable Gate Array (FPGA) IC 77 3200 238 100-TQFP

The XCS05-3VQ100I is a Spartan® Field Programmable Gate Array (FPGA) in a 100-TQFP package from AMD. It integrates 238 logic elements, approximately 3,200 bits of on-chip RAM, about 5,000 gates and 77 general-purpose I/O pins, providing a compact, programmable logic solution for industrial designs.

Built for industrial environments, this surface-mount FPGA operates from a 4.5 V to 5.5 V supply and across an extended temperature range of −40 °C to 100 °C, making it suited for applications that require robustness in harsher operating conditions.

Key Features

  • Core  Spartan® FPGA architecture with 238 logic elements and approximately 5,000 gates for implementing custom digital logic and glue functions.
  • On-chip Memory  Approximately 3,200 bits of embedded RAM to support small FIFOs, registers, and buffering directly on the device.
  • I/O Capacity  77 I/O pins to interface with peripherals, sensors, and external logic in compact systems.
  • Power  Operates from a 4.5 V to 5.5 V supply, enabling integration with 5 V-based systems and legacy interfaces.
  • Package & Mounting  Surface-mount device in a 100-TQFP footprint (supplier package: 100-VQFP, 14×14 mm) for space-conscious PCB layouts.
  • Industrial Temperature Range  Rated for −40 °C to 100 °C operation to meet industrial environment requirements.
  • Regulatory  RoHS compliant for environmental and materials compatibility in many commercial and industrial assemblies.

Typical Applications

  • Industrial Control  Implement control logic, state machines, and interface glue in factory automation systems where extended temperature range and 5 V compatibility are important.
  • Sensor Interface and Preprocessing  Aggregate and preprocess sensor data using on-chip logic and small embedded memory before passing results to a host processor.
  • Legacy System Integration  Provide programmable bridging and protocol adaptation in systems that rely on 5 V signaling and require compact packaging.
  • Prototyping and Custom Logic  Build and validate application-specific logic functions or timing-critical glue with a compact, surface-mount FPGA platform.

Unique Advantages

  • Compact, surface-mount package: 100-TQFP footprint lets you fit programmable logic into space-constrained PCBs without sacrificing I/O count.
  • Industrial-grade operating range: −40 °C to 100 °C rating supports deployment in demanding environments where thermal robustness is required.
  • 5 V supply compatibility: 4.5 V to 5.5 V supply simplifies integration with existing 5 V subsystems and legacy peripherals.
  • On-chip memory and logic capacity: Approximately 3,200 bits of RAM and 238 logic elements enable localized data buffering and modest logic integration, reducing external component count.
  • RoHS compliance: Meets common environmental material requirements for commercial and industrial product lines.

Why Choose XCS05-3VQ100I?

The XCS05-3VQ100I balances compact packaging, moderate logic and memory resources, and industrial-grade electrical and thermal tolerances, making it a pragmatic choice for engineers building robust, cost-conscious embedded systems. Its combination of 77 I/Os, 5 V supply compatibility and surface-mount 100-TQFP packaging makes it well suited for applications that require programmable logic without large form factors.

Engineers specifying this FPGA benefit from a vendor-backed Spartan® family device that delivers practical on-chip resources and regulatory compliance for many industrial use cases, enabling streamlined BOMs and simplified board-level integration.

Request a quote today to obtain pricing and lead-time information for the XCS05-3VQ100I.

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