XCS30-3BG256C

The XCS30-3BG256C is an AMD Spartan® Field Programmable Gate Array (FPGA) IC supplied in a 256-BBGA package. It delivers reconfigurable digital logic capability with a practical balance of logic resources, on-chip memory, and I/O count for commercial-grade designs.

This device is specified for commercial applications and provides 1,368 logic elements, 18,432 bits of embedded RAM (approximately 0.018 Mbits), 192 user I/Os and a 4.75–5.25 V supply range, with an operating temperature range of 0 °C to 85 °C.

Key Features

• Core Logic — 1,368 logic elements and an equivalent of 30,000 gates for implementing custom digital logic and state machines.
• On-chip Memory — 18,432 total RAM bits (approximately 0.018 Mbits) of embedded memory for data buffering and small on-chip storage needs.
• I/O Capacity — 192 I/Os to support dense interfacing and multiple parallel signal paths.
• Package & Mounting — 256-ball BGA package supplied as 256-PBGA (27 × 27); surface-mount mounting type for compact board integration.
• Power — Single supply range of 4.75 V to 5.25 V for system-level power planning.
• Operating Range & Grade — Commercial grade device rated for 0 °C to 85 °C operation.
• Environmental Compliance — RoHS compliant, meeting common environmental directives for lead-free assemblies.

Typical Applications

• Commercial embedded systems — Use the FPGA’s reconfigurable logic and on-chip memory to implement custom control and processing functions in commercial equipment.
• Prototyping and development — Suitable for hardware validation and iterative design where reprogrammable logic and flexible I/O are required.
• I/O-dense designs — High I/O count supports designs that require multiple parallel interfaces or signal aggregation on a single device.

Unique Advantages

• Balanced logic and memory — 1,368 logic elements combined with 18,432 bits of RAM provide a compact platform for many custom digital functions without external memory for small data needs.
• Generous I/O — 192 I/Os reduce the need for additional interface components when connecting multiple peripherals or parallel buses.
• Compact BGA footprint — 256-BBGA (256-PBGA, 27 × 27) package enables high-density board layouts while maintaining a robust solderable form factor.
• Commercial temperature and supply ranges — Specified operation from 0 °C to 85 °C and a 4.75–5.25 V supply allow straightforward integration into typical commercial power and thermal environments.
• Regulatory readiness — RoHS compliance supports lead-free assembly processes and regulatory requirements for many markets.

Why Choose XCS30-3BG256C?

The XCS30-3BG256C offers a practical FPGA option for commercial designs needing reconfigurable digital logic, moderate embedded memory, and a high number of I/Os in a compact BGA package. Its specified supply and temperature ranges, together with RoHS compliance, make it suitable for a wide range of commercial applications where board-level integration and environmental compliance matter.

Designers and procurement teams looking for a commercially graded Spartan® FPGA with a balanced mix of logic, memory, and I/O capacity will find the XCS30-3BG256C a straightforward choice for prototyping and production systems that require on-chip flexibility without expanding BOM complexity.

Request a quote or submit an inquiry to receive pricing and availability for the XCS30-3BG256C for your next commercial FPGA design.