XCS30-3PQ208C

The XCS30-3PQ208C is a Spartan® FPGA from AMD supplied in a 208‑BFQFP surface-mount package. It integrates 576 CLBs and 1,368 logic elements with 18,432 bits of on‑chip RAM and 169 general-purpose I/O pins, providing a compact, configurable logic platform for a wide range of commercial embedded designs.

Designed for 5 V systems (4.75 V to 5.25 V) and rated for commercial operating temperatures (0 °C to 85 °C), this device balances gate density and I/O capability while remaining RoHS compliant for standard product lifecycles.

Key Features

• Logic Resources  576 CLBs (configurable logic blocks) delivering a total of 1,368 logic elements to implement custom logic and state machines.
• On‑Chip Memory  18,432 bits of embedded RAM for data buffering, small lookup tables, and register storage within the FPGA fabric.
• I/O Capacity  169 user I/O pins to interface with peripherals, sensors, and external devices in high‑pin‑count designs.
• Gate Equivalent  Approximately 30,000 gates of equivalent logic scale to guide system partitioning and resource planning.
• Power and Supply  Operates from a 4.75 V to 5.25 V supply range for compatibility with standard 5 V embedded systems.
• Package and Mounting  208‑BFQFP package (supplier/package reference: 208‑PQFP, 28×28 mm) in a surface‑mount form factor for PCB assembly.
• Commercial Grade  Rated for 0 °C to 85 °C operation, suitable for commercial applications.
• Environmental Compliance  RoHS compliant to meet common material‑restriction requirements.

Unique Advantages

• Balanced Logic and Memory: The combination of 1,368 logic elements and 18,432 bits of embedded RAM supports compact digital designs that require both combinational and small storage resources.
• High I/O Count: 169 I/O pins enable broad interfacing capability without external expander components, simplifying board layout.
• Standard 5 V Support: Native operation at 4.75 V–5.25 V makes integration straightforward with legacy 5 V power domains.
• Surface‑Mount 208‑pin Package: The 208‑BFQFP (28×28) package provides a high pin density in a conventional SMT footprint for manufacturing scalability.
• Commercial Temperature Rating: Specified 0 °C to 85 °C operation aligns with typical commercial product requirements.
• RoHS Compliance: Material compliance reduces regulatory onboarding for commercial product builds.

Why Choose XCS30-3PQ208C?

The XCS30-3PQ208C positions itself as a practical Spartan® FPGA option for commercial embedded designs that require a moderate mix of logic, on‑chip memory, and a high number of I/O pins in a 208‑pin surface‑mount package. Its 1,368 logic elements, 18,432 bits of RAM, and 169 I/O make it suitable for control logic, glue logic, and interface aggregation where a compact FPGA is needed.

With a 4.75 V–5.25 V supply range, 0 °C–85 °C operating window, and RoHS compliance, this device offers a verifiable specification set for procurement and design planning, supported by AMD’s Spartan product family documentation.

Request a quote or submit a product inquiry to receive pricing, availability, and lead‑time information for the XCS30-3PQ208C. Our team can assist with ordering and technical procurement details.