XCS30-3TQ144C

The XCS30-3TQ144C is a Spartan® field programmable gate array (FPGA) from AMD, supplied in a 144-pin LQFP surface-mount package. This commercial-grade FPGA provides a compact, reprogrammable logic platform with on-chip memory and a moderate I/O count, suitable for a range of embedded designs and board-level integration.

Key device attributes include 1,368 logic elements, 18,432 bits of on-chip RAM, 113 I/O pins, and operation from a 4.75 V to 5.25 V supply across a 0 °C to 85 °C temperature range.

Key Features

• Core Logic 1,368 logic elements provide the programmable resources needed for implementing custom digital functions and control logic.
• Configurable Logic Blocks (CLBs) 576 CLBs available for flexible logic partitioning and resource allocation.
• Embedded Memory 18,432 bits of on-chip RAM for buffering, lookup tables, and small data storage needs.
• I/O Capability 113 general-purpose I/O pins to interface with peripherals, sensors, and other board-level devices.
• Power and Operating Range Single-supply operation from 4.75 V to 5.25 V and commercial operating temperature from 0 °C to 85 °C.
• Package and Mounting Surface-mount 144-LQFP package (supplier device package: 144-TQFP, 20×20) for compact PCB footprint and standard assembly processes.
• Environmental Compliance RoHS compliant, supporting regulatory requirements for lead-free assemblies.

Typical Applications

• Commercial Embedded Systems — Implement custom control logic and glue logic in compact, board-level designs that require programmable digital resources within a commercial temperature range.
• I/O Expansion and Bridge Functions — Use available 113 I/O pins to aggregate, buffer, or translate signals between subsystems and peripheral devices.
• Prototyping and Development — Reprogrammable logic and on-chip RAM support iterative development of digital functions and small-scale proof-of-concept designs.

Unique Advantages

• Balanced Logic and Memory: Combines 1,368 logic elements with 18,432 bits of on-chip RAM to support both control logic and modest data buffering without external memory.
• Compact, Standard Package: 144-LQFP surface-mount package (144-TQFP, 20×20) enables integration into space-constrained PCBs while remaining compatible with common assembly processes.
• Generous I/O Count: 113 I/O pins allow direct interfacing to multiple peripherals, sensors, and interfaces, reducing the need for additional interface ICs.
• Commercial-Grade Reliability: Rated for operation from 0 °C to 85 °C and RoHS compliant, making it suitable for mainstream commercial product deployments.
• Simplified Power Requirements: Operates from a single 4.75 V to 5.25 V supply, streamlining power rail design on typical commercial boards.

Why Choose XCS30-3TQ144C?

The XCS30-3TQ144C offers a practical combination of programmable logic, embedded memory, and I/O density in a compact 144-pin LQFP package, tailored for commercial-grade embedded designs. Its specification set supports designers who need reconfigurable digital resources and on-board RAM while maintaining a standard surface-mount form factor.

This device is well suited to engineers and teams developing board-level systems that require moderate logic capacity, multiple I/O connections, and straightforward supply and thermal requirements. Being RoHS compliant and supplied by AMD, it fits into established commercial design flows where reproducibility and component availability matter.

Request a quote or submit an inquiry to receive pricing and availability details for the XCS30-3TQ144C. Our team can assist with lead times and order placement to support your project schedule.