XCS30-4BG256C

The XCS30-4BG256C is a Spartan® FPGA from AMD delivering a compact, commercial-grade programmable logic solution. It provides 1,368 logic elements, 18,432 bits of on-chip RAM and 192 I/O pins in a 256-ball BGA package, suitable for designs that require moderate logic density and flexible I/O in a surface-mount form factor.

Designed for general-purpose embedded and digital logic applications, this device balances logic resources, on-chip memory and I/O count while operating from a 4.75 V to 5.25 V supply within a 0 °C to 85 °C commercial temperature range.

Key Features

• Core Logic 1,368 logic elements provide programmable combinational and sequential resources for implementing custom digital functions and control logic.
• Embedded Memory Total on-chip RAM of 18,432 bits supports small buffer, FIFO and state-machine storage needs without external memory.
• I/O Capacity 192 user I/O pins enable connectivity to peripherals, sensors and external buses for flexible system integration.
• Gate Count Approximately 30,000 gates for estimating overall design capacity and partitioning between logic and routing.
• Power Single-supply operation from 4.75 V to 5.25 V simplifies integration with legacy 5 V systems.
• Package & Mounting Available in a 256-BBGA (supplier device package 256-PBGA, 27 × 27 mm) surface-mount package to minimize board footprint while providing high pin density.
• Temperature & Grade Commercial-grade device specified for 0 °C to 85 °C operation for typical consumer and commercial electronic applications.
• Compliance RoHS compliant for environmentally responsible manufacturing and assembly.

Typical Applications

• Embedded control Implement custom control logic, state machines and peripheral management in compact embedded systems using the available logic elements and I/O.
• Interface bridging Connect and translate between parallel and serial peripherals or legacy interfaces using plentiful I/O and on-chip RAM for buffering.
• Digital prototyping Rapidly prototype digital functions and validate algorithms in hardware with modest resource requirements.
• User interfaces and sensors Aggregate sensor inputs and drive displays or peripheral devices using the device’s I/O capacity and on-chip memory for local data handling.

Unique Advantages

• Balanced resource mix: Combines 1,368 logic elements with 18,432 bits of RAM and 192 I/Os to address a wide range of small-to-medium FPGA tasks without overprovisioning.
• Compact high-density package: 256-ball BGA (27 × 27 mm) provides a small board footprint while offering high pin count for complex I/O routing.
• 5 V-friendly power range: Operates from 4.75 V to 5.25 V, easing integration into systems that use legacy 5 V power rails.
• Commercial availability: Rated for 0 °C to 85 °C for use in consumer and commercial electronic products.
• Environmentally compliant: RoHS compliance supports regulatory and manufacturing requirements for reduced hazardous substances.

Why Choose XCS30-4BG256C?

The XCS30-4BG256C offers a practical combination of logic capacity, embedded memory and I/O density in a compact surface-mount BGA package, making it well suited for designers building commercial embedded systems, interface bridges and digital prototypes. Its power and temperature specifications match common commercial environments, enabling straightforward integration into existing 5 V-based designs.

Manufactured by AMD, this Spartan® FPGA provides a predictable, mid-range programmable solution for projects that need moderate gate count and flexible I/O without the complexity of larger devices.

Request a quote or submit a pricing and availability inquiry to evaluate the XCS30-4BG256C for your next design.