XCS30-4PQ240C
| Part Description |
Spartan® Field Programmable Gate Array (FPGA) IC 192 18432 1368 240-BFQFP |
|---|---|
| Quantity | 1,059 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 240-PQFP (32x32) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 240-BFQFP | Number of I/O | 192 | Voltage | 4.75 V - 5.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 576 | Number of Logic Elements/Cells | 1368 | ||
| Number of Gates | 30000 | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 18432 |
Overview of XCS30-4PQ240C – Spartan® FPGA, 240-BFQFP, 192 I/O
The XCS30-4PQ240C is a Spartan® Field Programmable Gate Array (FPGA) IC from AMD designed for commercial-grade embedded logic applications. As an FPGA device, it provides programmable logic resources, on-chip RAM and a broad I/O count in a 240-pin BFQFP surface-mount package.
Its combination of approximately 1,368 logic elements, roughly 18.4 Kbits of embedded memory and 192 I/O pins makes the device well suited for commercial embedded designs that require moderate logic density, flexible interfacing and standard 5 V supply operation.
Key Features
- FPGA Core & Logic Approximately 1,368 logic elements delivering a total of 30,000 gates for implementing custom digital functions and glue logic.
- Embedded Memory Approximately 18.4 Kbits (18,432 bits) of on-chip RAM to support buffering, small lookup tables and state storage.
- I/O Capacity 192 user I/O pins to support multiple parallel interfaces, signal conditioning and external device connections.
- Power and Supply Operates from a 4.75 V to 5.25 V supply range for designs using standard 5 V rails.
- Package & Mounting 240-pin BFQFP (supplier package: 240-PQFP 32×32) in a surface-mount form factor for compact PCB layouts.
- Operating Range & Grade Commercial grade with an operating temperature range of 0 °C to 85 °C.
- Environmental Compliance RoHS compliant for use in assemblies that require lead-free components.
Typical Applications
- Commercial Embedded Systems Implements custom control logic and peripheral interfacing where moderate logic density and a high I/O count are required.
- Prototyping and Development Useful for proof-of-concept designs that need programmable resources and quick hardware iteration in a surface-mount package.
- Interface and Glue Logic Provides programmable protocol adaptation and signal routing between digital subsystems using the device’s abundant I/O.
Unique Advantages
- Balanced Logic Density: Approximately 1,368 logic elements and 30,000 gates provide adequate capacity for moderate-complexity designs without excessive board-level complexity.
- Substantial I/O Count: 192 I/O pins allow flexible parallel interfacing and multiple peripheral connections from a single device.
- On-Chip Memory: Around 18.4 Kbits of embedded RAM supports small buffers, LUTs and state machines without external memory.
- Standard 5 V Supply: Operates from a 4.75 V to 5.25 V range, simplifying integration into systems that use legacy 5 V rails.
- Compact Surface-Mount Package: 240-pin BFQFP (240-PQFP 32×32) enables space-efficient PCB implementations while maintaining signal density.
- RoHS Compliant: Meets lead-free assembly requirements for consumer and commercial electronics.
Why Choose XCS30-4PQ240C?
The XCS30-4PQ240C positions itself as a practical, commercial-grade FPGA offering a balanced mix of logic elements, embedded memory and a high I/O count in a compact 240-pin BFQFP package. It is suited to engineers building commercial embedded systems, interface logic and prototypes that require programmable flexibility alongside standard 5 V supply compatibility.
Manufactured by AMD, the device provides a clear specification set—logic density, on-chip RAM, I/O count, package and operating range—so designers can make predictable integration and BOM decisions for medium-complexity applications.
Request a quote or submit a pricing inquiry to discuss availability, lead times and volume options for the XCS30-4PQ240C.

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