XCS30XL-4BG256C

The XCS30XL-4BG256C is an AMD Spartan®-XL field programmable gate array (FPGA) supplied in a 256-ball BGA package. It provides a compact, surface-mount programmable logic solution with 1,368 logic elements and 192 user I/O pins for custom digital designs.

Designed for commercial-grade applications, the device includes 18,432 bits of on-chip RAM and approximately 30,000 gates of logic capacity, operating from a 3.0 V to 3.6 V supply and rated for 0 °C to 85 °C ambient temperature.

Key Features

• Logic Capacity  1,368 logic elements providing programmable combinational and sequential logic resources for custom functions and state machines.
• On-chip Memory  18,432 bits of total on-chip RAM for small buffers, FIFOs or distributed memory needs within the FPGA fabric.
• I/O Resources  192 user I/O pins to support multiple external interfaces, board-level connectivity and parallel signals.
• Gate Count  Approximately 30,000 gates enabling moderate-complexity digital implementations.
• Power  Single-supply operation with a voltage range of 3.0 V to 3.6 V for straightforward power-rail integration.
• Package & Mounting  256-ball BGA package (supplier device package: 256-PBGA, 27×27) in a surface-mount form factor for compact board layouts.
• Commercial Temperature Grade  Specified for 0 °C to 85 °C operation, suitable for standard commercial environments.
• Environmental Compliance  RoHS compliant for environmental and regulatory considerations.

Typical Applications

• Custom Logic Integration  Implement glue logic, protocol adaptation and bespoke digital functions where fixed-function ICs lack flexibility.
• Interface Bridging  Provide parallel or serial interface concentration and signal conditioning using the device's abundant I/O.
• Prototyping and Evaluation  Rapidly validate digital architectures and iterate designs before final ASIC or system integration.
• Control and Monitoring  Embed control state machines, simple signal processing and monitoring logic in compact systems.

Unique Advantages

• Programmable Flexibility:  Field-programmable logic lets you implement and update custom functions without redesigning PCBs.
• Compact, High-Connectivity Package:  256-ball BGA with 192 I/O enables dense board integration while retaining significant external connectivity.
• Balanced Resource Set:  A combination of 1,368 logic elements and 18,432 bits of RAM supports a wide range of moderate-complexity tasks.
• Commercial Grade for General Use:  Specified 0 °C to 85 °C temperature range and RoHS compliance align with mainstream product requirements.
• Straightforward Power Integration:  3.0 V to 3.6 V supply range simplifies power-rail design in commercial systems.

Why Choose XCS30XL-4BG256C?

The XCS30XL-4BG256C offers a practical mix of logic capacity, I/O count and on-chip memory in a compact BGA package, making it well suited for designers needing a flexible, programmable solution for commercial applications. Its combination of approximately 30,000 gates, 1,368 logic elements and 192 I/O pins supports moderate-complexity designs where reprogrammability and board-level integration are priorities.

Choose this FPGA when you need a commercially graded, RoHS-compliant programmable device that fits compact layouts and operates from a common 3.0 V–3.6 V supply. It provides a reliable platform for prototyping, interface logic and custom digital functions with vendor-backed lifecycle support.

Request a quote or submit a purchase inquiry to check availability and pricing for the XCS30XL-4BG256C. Our team can provide lead-time information and help with technical fit questions.