XCS30XL-4PQ240C

IC FPGA 192 I/O 240QFP
Part Description

Spartan®-XL Field Programmable Gate Array (FPGA) IC 192 18432 1368 240-BFQFP

Quantity 23 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package240-PQFP (32x32)GradeCommercialOperating Temperature0°C – 85°C
Package / Case240-BFQFPNumber of I/O192Voltage3 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs576Number of Logic Elements/Cells1368
Number of Gates30000ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits18432

Overview of XCS30XL-4PQ240C – Spartan®-XL Field Programmable Gate Array (FPGA) IC 192 I/O, 18,432 bits RAM, 1,368 Logic Elements, 240-BFQFP

The XCS30XL-4PQ240C is a Spartan®-XL Field Programmable Gate Array (FPGA) from AMD designed for commercial-grade embedded logic applications. It provides a mid-range logic capacity with approximately 1,368 logic elements, roughly 18,432 bits of on-chip RAM and up to 192 I/O pins for board-level digital integration.

With a nominal supply range of 3.0 V to 3.6 V, surface-mount 240-pin BFQFP packaging, and a commercial operating temperature range of 0 °C to 85 °C, this device is suited to designs that require moderate programmable logic density, significant I/O count, and RoHS-compliant assembly.

Key Features

  • Core Logic  Approximately 1,368 logic elements providing configurable combinational and sequential logic resources for glue logic, protocol handling, and custom finite state machines.
  • Embedded Memory  Approximately 18,432 bits of on-chip RAM to support buffering, small FIFOs, and lookup-table storage without external memory.
  • I/O Capacity  192 user I/O pins to connect multiple peripherals, buses, sensors, or interface domains at the board level.
  • Gate Count  Around 30,000 equivalent gates for estimating integration density and partitioning between logic and memory resources.
  • Power  Operates from a 3.0 V to 3.6 V supply range for compatibility with common 3.3 V system rails.
  • Package and Mounting  240-pin BFQFP surface-mount package (supplier device package: 240-PQFP, 32×32) for compact PCB layouts and standard SMT assembly.
  • Temperature and Grade  Commercial grade device rated for 0 °C to 85 °C operation, suitable for consumer and general-purpose commercial products.
  • Environmental Compliance  RoHS compliant to support lead-free assembly processes.

Typical Applications

  • Consumer and Commercial Electronics  Implement control logic, protocol bridging, and peripheral interfaces where moderate logic capacity and a high I/O count are required.
  • Board-Level Glue Logic  Replace multiple discrete devices by consolidating address decoders, bus arbitration, and timing control into a single programmable device.
  • Prototyping and Development  Use as a mid-density FPGA for proof-of-concept designs and functional validation prior to production implementation.
  • Sensor and Interface Aggregation  Aggregate sensor inputs and manage I/O routing for systems that require multiple digital interfaces and local buffering.

Unique Advantages

  • Balanced Logic and Memory  Provides a combination of approximately 1,368 logic elements and about 18,432 bits of RAM to support a variety of control and buffering tasks without external memory.
  • High I/O Count  192 I/O pins simplify board-level connectivity and reduce the need for external I/O expansion components.
  • Standard 3.3 V Compatibility  3.0 V–3.6 V supply range aligns with common 3.3 V system rails for straightforward power integration.
  • Compact Surface-Mount Package  240-pin BFQFP (240-PQFP supplier package) allows dense PCB layouts while remaining compatible with standard SMT processes.
  • Commercial Temperature Rating  Rated for 0 °C to 85 °C operation, suitable for consumer and general commercial product environments.
  • RoHS Compliant  Supports lead-free manufacturing and regulatory compliance for many global markets.

Why Choose XCS30XL-4PQ240C?

The XCS30XL-4PQ240C positions itself as a pragmatic choice for engineers who need a mid-density FPGA with a substantial I/O count and embedded RAM for on-board logic, interface handling, and prototyping tasks. Its combination of approximately 1,368 logic elements, roughly 18,432 bits of RAM, and 192 I/O pins provides the integration needed to reduce component count and simplify PCB designs for commercial products.

Manufactured by AMD and offered in a 240-pin surface-mount package with RoHS compliance and standard 3.3 V supply compatibility, this device is well suited to developers targeting consumer and commercial applications that operate within a 0 °C to 85 °C ambient range and require reliable, mid-range programmable logic capability.

Request a quote or submit an inquiry today to check pricing and availability for the XCS30XL-4PQ240C and to discuss how it fits your next design.

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