XCS30XL-4PQ240C
| Part Description |
Spartan®-XL Field Programmable Gate Array (FPGA) IC 192 18432 1368 240-BFQFP |
|---|---|
| Quantity | 23 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 240-PQFP (32x32) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 240-BFQFP | Number of I/O | 192 | Voltage | 3 V - 3.6 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 576 | Number of Logic Elements/Cells | 1368 | ||
| Number of Gates | 30000 | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 18432 |
Overview of XCS30XL-4PQ240C – Spartan®-XL Field Programmable Gate Array (FPGA) IC 192 I/O, 18,432 bits RAM, 1,368 Logic Elements, 240-BFQFP
The XCS30XL-4PQ240C is a Spartan®-XL Field Programmable Gate Array (FPGA) from AMD designed for commercial-grade embedded logic applications. It provides a mid-range logic capacity with approximately 1,368 logic elements, roughly 18,432 bits of on-chip RAM and up to 192 I/O pins for board-level digital integration.
With a nominal supply range of 3.0 V to 3.6 V, surface-mount 240-pin BFQFP packaging, and a commercial operating temperature range of 0 °C to 85 °C, this device is suited to designs that require moderate programmable logic density, significant I/O count, and RoHS-compliant assembly.
Key Features
- Core Logic Approximately 1,368 logic elements providing configurable combinational and sequential logic resources for glue logic, protocol handling, and custom finite state machines.
- Embedded Memory Approximately 18,432 bits of on-chip RAM to support buffering, small FIFOs, and lookup-table storage without external memory.
- I/O Capacity 192 user I/O pins to connect multiple peripherals, buses, sensors, or interface domains at the board level.
- Gate Count Around 30,000 equivalent gates for estimating integration density and partitioning between logic and memory resources.
- Power Operates from a 3.0 V to 3.6 V supply range for compatibility with common 3.3 V system rails.
- Package and Mounting 240-pin BFQFP surface-mount package (supplier device package: 240-PQFP, 32×32) for compact PCB layouts and standard SMT assembly.
- Temperature and Grade Commercial grade device rated for 0 °C to 85 °C operation, suitable for consumer and general-purpose commercial products.
- Environmental Compliance RoHS compliant to support lead-free assembly processes.
Typical Applications
- Consumer and Commercial Electronics Implement control logic, protocol bridging, and peripheral interfaces where moderate logic capacity and a high I/O count are required.
- Board-Level Glue Logic Replace multiple discrete devices by consolidating address decoders, bus arbitration, and timing control into a single programmable device.
- Prototyping and Development Use as a mid-density FPGA for proof-of-concept designs and functional validation prior to production implementation.
- Sensor and Interface Aggregation Aggregate sensor inputs and manage I/O routing for systems that require multiple digital interfaces and local buffering.
Unique Advantages
- Balanced Logic and Memory Provides a combination of approximately 1,368 logic elements and about 18,432 bits of RAM to support a variety of control and buffering tasks without external memory.
- High I/O Count 192 I/O pins simplify board-level connectivity and reduce the need for external I/O expansion components.
- Standard 3.3 V Compatibility 3.0 V–3.6 V supply range aligns with common 3.3 V system rails for straightforward power integration.
- Compact Surface-Mount Package 240-pin BFQFP (240-PQFP supplier package) allows dense PCB layouts while remaining compatible with standard SMT processes.
- Commercial Temperature Rating Rated for 0 °C to 85 °C operation, suitable for consumer and general commercial product environments.
- RoHS Compliant Supports lead-free manufacturing and regulatory compliance for many global markets.
Why Choose XCS30XL-4PQ240C?
The XCS30XL-4PQ240C positions itself as a pragmatic choice for engineers who need a mid-density FPGA with a substantial I/O count and embedded RAM for on-board logic, interface handling, and prototyping tasks. Its combination of approximately 1,368 logic elements, roughly 18,432 bits of RAM, and 192 I/O pins provides the integration needed to reduce component count and simplify PCB designs for commercial products.
Manufactured by AMD and offered in a 240-pin surface-mount package with RoHS compliance and standard 3.3 V supply compatibility, this device is well suited to developers targeting consumer and commercial applications that operate within a 0 °C to 85 °C ambient range and require reliable, mid-range programmable logic capability.
Request a quote or submit an inquiry today to check pricing and availability for the XCS30XL-4PQ240C and to discuss how it fits your next design.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








