XCS30XL-4TQ144C

IC FPGA 113 I/O 144TQFP
Part Description

Spartan®-XL Field Programmable Gate Array (FPGA) IC 113 18432 1368 144-LQFP

Quantity 603 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package144-TQFP (20x20)GradeCommercialOperating Temperature0°C – 85°C
Package / Case144-LQFPNumber of I/O113Voltage3 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs576Number of Logic Elements/Cells1368
Number of Gates30000ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits18432

Overview of XCS30XL-4TQ144C – Spartan®-XL FPGA, 113 I/O, 144‑LQFP

The XCS30XL-4TQ144C is a Spartan®-XL field programmable gate array (FPGA) IC designed for commercial electronic designs requiring reconfigurable logic and flexible I/O. It combines on-chip logic resources, embedded RAM, and a compact surface-mount package to support a range of embedded and system-level applications.

Key Features

  • Core Logic Approximately 1,368 logic elements enabling a variety of programmable logic implementations.
  • Embedded Memory 18,432 bits of on-chip RAM for data buffering, small lookup tables, and state storage.
  • I/O Count 113 user I/O pins to support multiple peripherals and external interfaces.
  • Gate Equivalent Approximately 30,000 gates providing a practical balance of capacity and compact footprint.
  • Power Voltage supply range of 3.0 V to 3.6 V, enabling compatibility with common commercial power rails.
  • Package & Mounting 144-LQFP package case (supplier device package: 144-TQFP, 20×20) in a surface-mount form factor for PCB assembly.
  • Operating Conditions Commercial grade operation from 0 °C to 85 °C.
  • Environmental Compliance RoHS compliant.

Typical Applications

  • Embedded Control — Implement custom control logic, state machines, and glue logic where reconfigurability and a moderate logic count are required.
  • I/O Expansion and Bridging — Use the 113 I/O pins to interface between sensors, peripherals, and host processors or to implement protocol bridging.
  • Prototyping and Development — Rapidly iterate hardware designs and validate logic using the FPGA’s reprogrammable resources and on-chip RAM.

Unique Advantages

  • Compact, surface-mount integration: 144-pin LQFP/TQFP package supports high-density PCB assembly while conserving board area.
  • Balanced logic and memory: The combination of ~1,368 logic elements and 18,432 bits of RAM provides workable capacity for medium-complexity designs without excessive overhead.
  • Generous I/O provisioning: 113 user I/O pins enable direct interfacing to multiple peripherals and external devices, reducing the need for additional external components.
  • Commercial temperature rating: Rated for 0 °C to 85 °C to meet the needs of standard commercial electronics applications.
  • RoHS compliant: Meets common environmental regulatory requirements for lead-free assembly.
  • Standard power domain: Operates from a 3.0 V to 3.6 V supply, aligning with common commercial logic power rails.

Why Choose XCS30XL-4TQ144C?

The XCS30XL-4TQ144C positions itself as a practical, reconfigurable solution for commercial embedded designs that require a mix of moderate logic capacity, embedded RAM, and ample I/O in a compact surface-mount package. Its specification set—logic elements, on-chip memory, and a 113-pin I/O complement—makes it well suited for designers balancing functionality, board space, and integration.

For engineers and procurement teams developing prototypes or production devices in commercial temperature ranges, this FPGA offers predictable capabilities and RoHS compliance, supporting straightforward integration into existing development and manufacturing workflows.

Request a quote or submit an inquiry to obtain pricing, lead time, and availability information for the XCS30XL-4TQ144C.

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