XCS30XL-4PQG208C

The XCS30XL-4PQG208C is a Spartan®-XL series Field Programmable Gate Array (FPGA) IC from AMD, delivered in a 208-pin BFQFP surface-mount package. It provides a compact, commercial-grade programmable logic solution with a defined complement of logic elements, embedded memory, and general-purpose I/O suitable for configurable digital designs.

With 1,368 logic elements, approximately 18,432 bits of on-chip RAM, and 169 I/O pins, this device targets commercial applications that require mid-density logic integration, flexible I/O count and modest embedded memory while operating from a 3.0 V to 3.6 V supply and a 0 °C to 85 °C temperature range.

Key Features

• Logic Capacity: 1,368 logic elements provide programmable combinational and sequential resources for implementing custom digital functions.
• Embedded Memory: Approximately 18,432 bits of on-chip RAM to store configuration data, buffering or small tables directly within the FPGA fabric.
• I/O Density: 169 general-purpose I/O pins support flexible interfacing to peripherals, sensors and external logic.
• Gate Equivalent: 30,000 gates, offering a quantifiable view of device complexity for system partitioning and integration planning.
• Package & Mounting: 208-BFQFP (208-PQFP, 28 × 28) surface-mount package suitable for compact board layouts.
• Power Supply: Operates from a 3.0 V to 3.6 V supply, allowing straightforward integration with common commercial power rails.
• Operating Range: Commercial temperature grade specified from 0 °C to 85 °C for typical commercial-environment deployments.
• RoHS Compliant: Meets RoHS environmental requirements for lead-free assembly and regulatory compliance.

Typical Applications

• Custom Digital Logic: Implement finite state machines, protocol translators or glue logic using 1,368 logic elements and on-chip RAM.
• I/O Expansion and Bridging: Use the 169 I/O pins to consolidate and adapt interfaces between subsystems or to provide parallel/serial bridging functions.
• Prototyping and Development: Evaluate and iterate mid-density FPGA designs in commercial product development cycles using a surface-mount 208-pin package.
• Embedded Control: Integrate control logic and small data buffering within the FPGA fabric leveraging the embedded RAM and gate capacity.

Unique Advantages

• Balanced Logic and Memory: The combination of 1,368 logic elements and ~18,432 bits of RAM supports a variety of mid-density applications without external memory for many use cases.
• High I/O Count in a Compact Package: 169 I/O pins in a 208-PQFP (28 × 28) footprint provide significant interface options while conserving PCB area.
• Commercial-Grade Reliability: Specified operating temperature of 0 °C to 85 °C aligns the device to standard commercial deployments.
• RoHS Compliance: Lead-free manufacturing compatibility simplifies regulatory compliance for modern product builds.
• Straightforward Power Integration: 3.0 V to 3.6 V supply range fits common commercial power architectures for simplified system design.

Why Choose XCS30XL-4PQG208C?

The XCS30XL-4PQG208C delivers a mid-density, commercial-grade FPGA option that balances logic capacity, embedded RAM and I/O density in a compact surface-mount package. It is well suited for designers needing configurable digital resources and flexible interfacing within the constraints of commercial temperature and supply ranges.

This device is appropriate for engineers and procurement teams working on prototypes, control logic modules, or interface consolidation tasks where a vendor-supported Spartan®-XL FPGA with measurable logic, memory and I/O specifications provides a practical, integrable building block.

Request a quote or submit a pricing inquiry to receive availability, lead-time and ordering information for the XCS30XL-4PQG208C.