XCS30XL-4PQ208I

The XCS30XL-4PQ208I is a Spartan®-XL field programmable gate array (FPGA) IC from AMD, offered in a 208-BFQFP package. It provides a mid-level integration of programmable logic, on-chip RAM and I/O suitable for industrial applications that require configurable digital logic in a surface-mount form factor.

With 1,368 logic elements, 18,432 bits of embedded RAM and 169 user I/O pins, this device targets designs needing moderate logic capacity, substantial I/O count and a broad operating temperature range while operating from a 3 V to 3.6 V supply.

Key Features

• Core Logic — 1,368 logic elements and approximately 30,000 gates provide moderate-density programmable logic for glue logic, state machines and custom digital functions.
• Embedded Memory — 18,432 bits of on-chip RAM enable local data buffering, small FIFOs and storage for control state without external memory.
• I/O Capacity — 169 available I/O pins support a wide range of external interfaces and parallel connectivity requirements.
• Power — Operates from a 3 V to 3.6 V supply, matching common embedded power rails.
• Package & Mounting — 208-BFQFP package in a surface-mount form factor; supplier device package listed as 208-PQFP (28x28).
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C for temperature-sensitive deployments.
• Environmental Compliance — RoHS compliant for reduced hazardous substances in manufacturing.

Typical Applications

• Industrial control and automation — Use the device’s industrial temperature rating and 169 I/O pins to implement control logic, signal aggregation and glue logic in factory or process environments.
• I/O expansion and protocol bridging — Moderate logic capacity and plentiful I/O enable interface adaptation between sensors, actuators and host processors.
• Embedded system peripherals — On-chip RAM and logic elements allow implementation of custom peripherals, small data buffers and deterministic control functions within embedded products.

Unique Advantages

• Balanced logic density: 1,368 logic elements and ~30,000 gates deliver a usable capacity for mid-range programmable tasks without excessive complexity.
• Significant I/O availability: 169 user I/Os reduce the need for additional I/O expanders in multi-sensor or multi-interface designs.
• On-chip RAM support: 18,432 bits of embedded RAM provide local memory for buffering and state storage, simplifying external memory requirements.
• Industrial-grade temperature range: −40 °C to 100 °C operation helps ensure reliable behavior in demanding environmental conditions.
• Surface-mount packaging: 208-BFQFP surface-mount package (supplier: 208-PQFP (28x28)) facilitates automated PCB assembly.
• RoHS compliant: Conforms to RoHS requirements for reduced hazardous substance content in production.

Why Choose XCS30XL-4PQ208I?

The XCS30XL-4PQ208I combines a Spartan®-XL FPGA architecture with a practical mix of logic, memory and I/O count tailored for industrial and embedded applications that need configurable digital logic in a surface-mount package. Its operating voltage range and industrial temperature rating make it suitable for designs that must run reliably across varied thermal environments.

This part is appropriate for engineers and procurement teams seeking a mid-density FPGA from AMD that balances integration and I/O capability while remaining RoHS compliant. It provides a compact, programmable building block for control, interface and peripheral functions in production systems.

Request a quote or submit an inquiry to check availability and pricing for the XCS30XL-4PQ208I and to discuss how it can meet your design requirements.