XCS30XL-4TQ144I

The XCS30XL-4TQ144I is a Spartan®-XL family FPGA from AMD designed for moderate-density programmable logic and I/O integration. It combines approximately 1,368 logic elements, 18,432 bits of on-chip RAM, and 113 user I/Os in a compact 144-LQFP surface-mount package.

Targeted at industrial applications, this device operates from a 3.0 V to 3.6 V supply and across an industrial temperature range of −40 °C to 100 °C, offering a balance of integration, I/O flexibility, and temperature robustness for embedded and control-oriented designs.

Key Features

• Core Logic  Approximately 1,368 logic elements providing a moderate level of programmable logic capacity suitable for glue logic, control engines, and custom peripheral implementations.
• Embedded Memory  18,432 bits of on-chip RAM (approximately 0.018 Mbits) for small buffers, FIFOs, and state storage close to the logic fabric.
• I/O Capability  113 user I/Os to support multiple parallel interfaces, sensor connections, and peripheral control lines without external I/O expanders.
• Gate Count  Approximately 30,000 gates for overall device complexity and integration planning.
• Power  Single-supply operation from 3.0 V to 3.6 V to match common industrial logic domains.
• Package & Mounting  144-LQFP surface-mount package (supplier device package: 144-TQFP, 20×20) for compact PCB designs and automated assembly.
• Operating Temperature  Industrial-grade operation from −40 °C to 100 °C for deployments in demanding environmental conditions.
• Compliance  RoHS-compliant construction to support regulatory requirements for lead-free assemblies.

Typical Applications

• Industrial Control & Automation  Use the device’s industrial temperature rating and 113 I/Os to implement control logic, I/O aggregation, and protocol bridging for factory automation equipment.
• Embedded System Glue Logic  Provide customizable timing, bus interfacing, and peripheral control in embedded designs where a moderate number of logic elements and I/Os simplify board-level integration.
• Instrumentation & Test Equipment  Leverage on-chip RAM and flexible I/O to implement data capture buffers, signal conditioning interfaces, and custom measurement logic.

Unique Advantages

• Balanced Logic Density:  Approximately 1,368 logic elements and ~30,000 gates deliver sufficient capacity for mid-range programmable functions without excessive cost or board area.
• Ample I/O for Integration:  113 I/Os reduce the need for external interface components, simplifying BOM and PCB routing for multi-signal systems.
• Industrial Temperature Range:  Rated from −40 °C to 100 °C to maintain operation in challenging thermal environments common in industrial deployments.
• Compact Surface-Mount Package:  144-LQFP (20×20) package enables compact PCB layouts and compatibility with automated assembly processes.
• Low-Voltage Single-Supply Operation:  3.0 V to 3.6 V supply range aligns with common system logic levels for straightforward power design.
• RoHS-Compliant:  Built to meet RoHS requirements for lead-free manufacturing and global regulatory acceptance.

Why Choose XCS30XL-4TQ144I?

The XCS30XL-4TQ144I positions itself as a practical FPGA choice where moderate programmable logic, substantial I/O count, and industrial temperature capability are required. Its combination of approximately 1,368 logic elements, 18,432 bits of embedded RAM, and 113 I/Os in a 144-LQFP package provides designers a compact, integrated option for embedded controllers, interface logic, and instrumentation modules.

Backed by AMD’s Spartan®-XL family heritage, this device suits developers and procurement teams looking for a reliable, RoHS-compliant FPGA that balances integration, thermal robustness, and straightforward power requirements for industrial and embedded applications.

Request a quote or submit a purchase inquiry to begin integrating the XCS30XL-4TQ144I into your next design project.