XCS30XL-4PQ208C

The XCS30XL-4PQ208C is a Spartan®-XL field programmable gate array from AMD supplied in a 208‑pin BFQFP surface-mount package. It provides a moderate-density logic resource set with 1,368 logic elements, approximately 30,000 gates and 18,432 bits of on-chip RAM, alongside 169 user I/O pins.

Designed for commercial applications, the device operates from a 3.0 V to 3.6 V supply and across a 0 °C to 85 °C temperature range. Its combination of logic, embedded memory and I/O in a compact PQFP package suits compact, board-level digital designs where space and integration are important.

Key Features

• Logic Capacity  1,368 logic elements and approximately 30,000 gates provide the programmable combinational and sequential resources for implementing custom logic functions.
• Embedded Memory  18,432 bits of on-chip RAM support buffering, small lookup tables and state storage without external memory.
• I/O Resources  169 user I/O pins allow multiple peripheral and interface connections directly to the FPGA fabric.
• Power  Operates from a 3.0 V to 3.6 V supply, enabling straightforward integration with standard commercial-voltage systems.
• Package & Mounting  208-BFQFP (supplier device package: 208‑PQFP 28×28) in a surface-mount form factor for dense PCB implementations.
• Operating Range & Grade  Commercial grade device rated for 0 °C to 85 °C operation.
• Compliance  RoHS compliant for environmental and manufacturing compatibility.

Typical Applications

• Embedded control and logic consolidation  Use the programmable fabric and on-chip RAM to implement control algorithms, glue logic and state machines in compact systems.
• Interface bridging and I/O expansion  Leverage 169 I/O pins to aggregate signals, adapt interfaces, or implement protocol translation between subsystems.
• Prototyping and low- to mid-volume products  The combination of moderate logic density and a compact PQFP package is suited to early-stage development and production where board-level integration matters.

Unique Advantages

• Balanced logic-to-I/O ratio: The device pairs 1,368 logic elements with 169 I/O pins, enabling designs that require both programmable logic and substantial external connectivity.
• On-chip memory for local buffering: 18,432 bits of embedded RAM reduce dependence on external memory for small buffers and tables.
• Compact surface-mount package: 208‑pin BFQFP (28×28 PQFP footprint) simplifies PCB layout for space-constrained applications.
• Commercial-temperature operation: Rated 0 °C to 85 °C for deployment in standard commercial environments.
• RoHS compliant: Supports lead-free manufacturing and regulatory requirements for many regions and customers.

Why Choose XCS30XL-4PQ208C?

The XCS30XL-4PQ208C positions itself as a practical, commercially graded FPGA option for designs that need a moderate amount of programmable logic, on-chip memory and a generous complement of I/O in a compact, surface-mount PQFP package. Its 3.0 V to 3.6 V power envelope and RoHS compliance make it straightforward to integrate into standard commercial systems.

This part is well suited for engineers and OEMs developing board-level digital subsystems, interface logic, and prototypes where a balance of integration, footprint and predictable operating conditions is required. The device’s specifications support scalable designs that rely on on-chip resources to reduce BOM complexity and simplify PCB integration.

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