XCS30XL-4CS280C

The XCS30XL-4CS280C is a Spartan®-XL field programmable gate array (FPGA) IC featuring 1,368 logic elements, approximately 18,432 bits of on-chip RAM, and 192 general-purpose I/O. Packaged in a 280-ball TFBGA/CSPBGA (supplier package: 280-CSBGA, 16×16) and rated for commercial temperature operation, it targets compact, board-level digital logic implementations.

With a supply voltage range of 3.0 V to 3.6 V and surface-mount packaging, this device is suited for designs that require a balance of logic density, embedded memory, and a moderate I/O count within a small footprint.

Key Features

• Logic Capacity  The device provides 1,368 logic elements and an estimated 30,000 gates for implementing custom digital functions.
• Embedded Memory  Approximately 18,432 bits (≈0.018 Mbits) of on-chip RAM for small buffers, state storage, and control structures.
• I/O  192 general-purpose I/O pins to support a wide range of peripheral interfaces and board-level connections.
• Power  Operates from a 3.0 V to 3.6 V supply range suitable for standard 3.3 V system domains.
• Package & Mounting  280-TFBGA/CSPBGA package with supplier device package 280-CSBGA (16×16); designed for surface-mount assembly.
• Operating Range & Grade  Commercial grade operation from 0 °C to 85 °C.
• Regulatory Compliance  RoHS-compliant.

Typical Applications

• Prototyping and Custom Logic  Implement custom state machines, glue logic, and experimental digital designs using the device’s 1,368 logic elements and on-chip RAM.
• Embedded Control  Use the FPGA’s logic and I/O resources for board-level control tasks, peripheral interfacing, and simple data buffering.
• I/O Expansion and Bridging  192 I/O pins provide capability for interfacing multiple peripherals, sensors, or parallel buses on compact PCBs.

Unique Advantages

• Compact BGA Package: The 280-ball TFBGA/CSPBGA (280-CSBGA, 16×16) delivers a high-pin-count footprint in a compact surface-mount form factor, saving PCB real estate.
• Balanced Logic and Memory: Combines 1,368 logic elements with approximately 18,432 bits of on-chip RAM to support small to moderate digital functions without external memory.
• Generous I/O Count: With 192 I/O pins, the device supports multiple peripheral interfaces and parallel connections at the board level.
• Standard 3.3 V Compatibility: A 3.0 V to 3.6 V supply range aligns with common 3.3 V system domains for straightforward power system integration.
• Commercial Temperature Rating: Rated for 0 °C to 85 °C operation for typical commercial applications and environments.
• RoHS Compliance: Meets RoHS requirements for systems targeting lead-free and environmentally regulated manufacturing.

Why Choose XCS30XL-4CS280C?

The XCS30XL-4CS280C provides a practical balance of logic density, embedded memory, and I/O capability in a compact BGA package for commercial-grade designs. Its combination of 1,368 logic elements, approximately 18,432 bits of on-chip RAM, and 192 I/O makes it well suited for board-level digital logic, control, and I/O-intensive tasks where footprint and standard supply compatibility matter.

For projects requiring a RoHS-compliant, surface-mount FPGA with a moderate gate count and a 16×16 BGA footprint, this part offers a straightforward, verifiable specification set to simplify integration and procurement.

Request a quote or submit an inquiry to obtain pricing and availability for the XCS30XL-4CS280C.