XCS30-3TQ144I

IC FPGA 113 I/O 144TQFP
Part Description

Spartan® Field Programmable Gate Array (FPGA) IC 113 18432 1368 144-LQFP

Quantity 125 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package144-TQFP (20x20)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case144-LQFPNumber of I/O113Voltage4.5 V - 5.5 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs576Number of Logic Elements/Cells1368
Number of Gates30000ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits18432

Overview of XCS30-3TQ144I – Spartan® Field Programmable Gate Array (FPGA) IC 144-LQFP

The XCS30-3TQ144I is a Spartan® Field Programmable Gate Array (FPGA) IC from AMD, supplied in a 144-lead LQFP surface-mount package. It provides a compact, reprogrammable logic resource with on-chip memory and a broad I/O complement for embedded and industrial applications operating from 4.5 V to 5.5 V.

With support for industrial temperature operation and RoHS compliance, this device is intended for designs that require a modest logic capacity, integrated RAM, and a standard 144-TQFP (20 × 20) PCB footprint.

Key Features

  • Logic Capacity  Approximately 1,368 logic elements to implement custom digital functions and state machines.
  • Logic Array Blocks  576 LABs for structured logic grouping and hierarchical design partitioning.
  • Embedded Memory  Approximately 18,432 bits of on-chip RAM for small FIFOs, buffering and local storage.
  • I/O and Gate Count  113 I/O pins and a gate-equivalent count of 30,000 to support a variety of peripheral interfaces and glue logic functions.
  • Power  Operates from a 4.5 V to 5.5 V supply range, compatible with legacy 5 V system domains.
  • Package and Mounting  Surface-mount 144-LQFP package (listed as 144-TQFP 20×20 footprint) for compact PCB integration.
  • Temperature and Grade  Industrial grade rated for operation from −40 °C to 100 °C for deployment in temperature-challenging environments.
  • Compliance  RoHS compliant to meet environmental and regulatory requirements.

Unique Advantages

  • Compact, standard footprint: The 144-LQFP / 144-TQFP (20×20) package simplifies PCB layout and allows reuse of common footprints across designs.
  • Balanced logic and memory: Combination of ~1,368 logic elements with ~18.4k bits of embedded RAM supports local buffering and moderate logic integration without external memory.
  • High I/O count for the class: 113 I/O pins enable interfacing to multiple peripherals, sensors, and control buses within a single device.
  • Industrial temperature range: Rated from −40 °C to 100 °C for reliable operation in demanding thermal environments.
  • 5 V system compatibility: 4.5 V to 5.5 V supply range eases integration into legacy 5 V systems and simplifies power-domain planning.
  • Environmental compliance: RoHS compliance supports regulatory requirements and eco-conscious product designs.

Why Choose XCS30-3TQ144I?

The XCS30-3TQ144I positions itself as a practical FPGA choice for engineers needing a moderate amount of programmable logic, embedded memory, and substantial I/O in a compact, industry-grade package. Its combination of ~1,368 logic elements, approximately 18,432 bits of RAM, and 113 I/O pins makes it suitable for applications that require on-chip buffering, interface consolidation, and reprogrammable control logic while maintaining a standard 144-LQFP footprint.

Choose this device when you need a RoHS-compliant, surface-mount FPGA with a 4.5 V–5.5 V supply range and an industrial −40 °C to 100 °C operating window for reliable, long-term deployment in constrained PCB designs.

Request a quote or submit an inquiry to get pricing and availability for the XCS30-3TQ144I.

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